Electronics Forum: 1a33 deg c (Page 4 of 44)

Rework Nihon Solder

Electronics Forum | Wed Oct 12 14:13:08 EDT 2005 | Inds

SN100C is the Nihon solder. I had wave solder the board using SAC. Then had to put on solder pot, which had SN100C (nihon) solder. I think I went upto 130-135 deg C.. Let me try cooking it to 150degC Thanks

Asahi Viromet Lead Free Paste

Electronics Forum | Thu Mar 01 19:27:48 EST 2007 | Wayne

Yes, I am currently using Viromet 347 at the moment for my SMT lines. 100-150, 35 sec 150-207, 40 sec 207-above, 80 sec peak temp: 225 deg C. It is compatible to SAC paste in term of solderability and wettability. But in term of mechanical property (

Non-wettig on chip cap.

Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny

Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta

SMT process Blowhole/ Pinhole

Electronics Forum | Fri Mar 28 00:56:50 EST 2003 | iman

we have a issue of post-reflow oven (SMT) soldering defects of blowholes and pinholes. Any suggestions or knowledge on root cause is appreciated to be share? BACKGROUND : we DI water wash and oven bake the PCB bareboards at 90deg-C for 60mins, to r

BGA's ramp up rate in a convection oven

Electronics Forum | Tue Dec 28 10:04:01 EST 2004 | Mark

No delta T issues as I am not actually reflowing the component to the PCB. This is for moisture sensitivity testing as per JEDEC 020C Standard. Trying to duplicate a profile in the standard and am having trouble reaching a component ramp rate of 3

MSD Storage

Electronics Forum | Tue Nov 06 12:43:31 EST 2012 | deanm

4.2.7.1 states, ...If the bake temperature is not greater than 90 °C, there is no practical limit on bake time... If I interpret that correctly, then you may keep MSDs in a 40 deg. C oven indefinitely with no adverse conditions. Instead of opting

Re: Andon BGA Socket Soldering Problem - Ball Collapse

Electronics Forum | Thu Jul 15 08:03:36 EDT 1999 | Mark Quealy

I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run

non-wetting

Electronics Forum | Fri May 17 22:25:51 EDT 2002 | xzinxzin

*the other components are 0402 and SOIC 16, the solderability were good. *the protection on the terminations of microleadframe package is Cu(copper),somebody call that leadless leadframe package(LLP). *the time above 210 deg C is about 10 sec. *I us

LED (Seven Segment) found with missing segment and dimmer

Electronics Forum | Wed Jul 20 03:10:45 EDT 2011 | umar

I have mount the 8 pcs SEVEN SEGMENT LEDS on the PWB side at SMT Process, after reflow the board test at customer side and facing some issues which is missing segment and also one segment founded dimmers compare to other segment. Data sheet of LEDs

Heller MK3 edge chain maintenance

Electronics Forum | Fri Feb 14 14:09:06 EST 2014 | marcpeo

In general the chains don't need to be heated to 400 deg C for cleaning. In other words, most of the fluxes and constituents in the paste don't collect on the chain and gum it up. Bottom line: the heat treatment is not needed for 95% of the users.


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