Electronics Forum | Thu Aug 26 03:58:32 EDT 2010 | jacki
Hi all Did anyone encounter that the thermal crack failure or any failure issue by using the Kemet Ceramic Cap, particularly 0.1uF,while wave soldering? Before using this part, I want to clarify whether it is suitable for our process or not. Thanks i
Electronics Forum | Mon Oct 04 07:48:34 EDT 2010 | scottp
When you break them where is the failure? Is it the solder joint (doubtful), the part termination, the body of the part, or the board? If in the solder joint, is it in the bulk solder or intermetallic? If in the part, what direction is the crack?
Electronics Forum | Fri Oct 15 08:01:12 EDT 2010 | patrickbruneel
What you have is blowholes. Baking your boards prior to soldering will help. Root cause is either barrel plating too thin or barrel cracks allowing laminate moisture to escape. Patrick
Electronics Forum | Fri Oct 15 08:00:09 EDT 2010 | patrickbruneel
What you have is blowholes. Baking your boards prior to soldering will help. Root cause is either barrel plating too thin or barrel cracks allowing laminate moisture to escape. Patrick
Electronics Forum | Fri Apr 16 11:36:33 EDT 2010 | fönsi
Thank you for the links. I didn't know that there are companys that build test systems for ultrasonic inspection. My idea was to use a ultrasonic detector similar to crack inspection, for example to detect if the cooling pad is melted, or a solder jo
Electronics Forum | Fri Jun 25 00:16:11 EDT 2010 | leadthree
I got a report from Yageo yesterday with microsections and and and..... result: Cracks I did a test run on boards after ICT, but before coating. They are all ok. Seems the cracking happens somewhere after the ICT. But at that stage all assembly is a
Electronics Forum | Thu Feb 11 08:14:41 EST 2010 | scottp
It's OK to have the daisychain done in the interposer rather than the die (and a lot cheaper) but in thermal cycling the parts MUST have representative die. That's where a large part of the CTE mismatch comes from to cause fatigue damage. Thermal c
Electronics Forum | Wed Apr 14 10:24:17 EDT 2010 | fönsi
Hello Does somebody of you have some experiences with ultrasonic detectors in SMT-Production? Is it possible to test quality of solder joints by using a ultrasonic detector similar to non destrucitve crack inspection tests? Is there a manufacturer fo
Electronics Forum | Tue Jun 22 00:20:21 EDT 2010 | leadthree
Pick & Place > Wave-solder > other parts > test > conformal coating Is there any production error that could make a ceramic cap conductive? PS: want to add one point: The caps don't seem to be cracked. We changed a few 100 and didn't notice any bro
Electronics Forum | Mon Feb 22 10:19:57 EST 2010 | swag
Check/reseat all connections on axis driver card and from driver card to step motor. On older MpM's it is common to get a bad connection on the connector for axis driver power and blow components on your driver board. Reseating these connectors mig
