Electronics Forum | Wed Apr 18 01:07:25 EDT 2001 | MW
I some something like this. My package was not flat the belly of the body rested on the PCB. We found that every 4-5 part would wander to the side. What was puzzling is that the blowers would have blown it the opposite side. ultumately we proved
Electronics Forum | Wed Sep 23 16:44:04 EDT 1998 | Phil Szypko
| I can't seem to copy URL or company addresses for pasting from the SMTNet Directory. Dave F Dave, IE 4 seems to work fine with copy, yet Netscape 4.5b does not even allow a highlight. I think it must be a bug in Netscape. We are also changing the
Electronics Forum | Fri Aug 24 18:00:23 EDT 2001 | Marshall
Hi, I understand that solder joint shape and strentgth is dictated by land dimension / geometries. i have a pcb with 4-5 different land dimensions. My queries are: a) since all of them were tested, what will be the effect if I leave it that way whi
Electronics Forum | Mon Apr 07 13:02:30 EDT 2003 | kmorris
Sorry, I forgot to include the stencil thickness. It is 5 mil. Thanks for the input, everbody. I just checked with our stencil supplier & I thought that Electro-polish was standard with lazer, but I now find out it is not. Our stencil did not get
Electronics Forum | Sun Apr 27 18:38:55 EDT 2003 | Yngwie
One of my customer asking me about my capability on soldering nickel strip onto the PCB pad. Given the size of the pad of 80 mil X 80 mil, and he want to ensure that we can pass 4.5kg peel force(solder wire Sn63/Pb37). Anybody with this experience ?
Electronics Forum | Wed Jan 17 11:30:23 EST 2007 | Colleen Miller
We have some larger MSL3 parts that require baking. they are 6mm thick which takes them off the chart provided at http://www.jedec.org/download/search/jstd033a.pdf Does anyone have a reference that would tell me the baking times for these component
Electronics Forum | Mon Jan 22 16:41:21 EST 2007 | davef
Contact: * JC-14.1 Subcommittee on Reliability; Chair: Jack McCullen, Intel; jack.t.mccullen@intel.com 480-554-5354 * Rich Shook, Brian Vaccaro, and Brian Pottieger - Agere Systems [ http://www.agere.com ] * Francois Monette; Cogiscan Inc.; 450-534-2
Electronics Forum | Thu Jul 19 17:22:17 EDT 2007 | gregoryyork
You need to dwell the boards longer in the wave as the board is the largest heatsink. Just make sure the flux can take the longer dwell times anything up to 4 - 5 seconds so you may have to shallow your angle as well to around 5 - 6 degrees this will
Electronics Forum | Wed Oct 31 04:37:15 EDT 2007 | aj
Hi, My oven has 5 zones each 12 inches in length , giving a total of 70 inches Heating Zone in total. I am working with a 6 layer PCB ,ENIG Finish. I am using Alpha OM338T no-clean Solder Paste. I am working to a cycle time of 4 to 4.5mins RTS p
Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla
We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n
