Electronics Forum: 4.4 (Page 4 of 5)

Lead Free Wave Soldering

Electronics Forum | Wed Jul 28 18:51:52 EDT 2004 | gregoryyork

Found problem many years ago by chemical extraction and IR analysis, produces alarming amounts of plasticizer from under cured or incorrect mix of hardener to liquid photoimageable solder resist. Problems this causes are endless and many things blame

Samtec Searay 500 pin connector solder wicking issue after reflow

Electronics Forum | Mon Jan 13 17:39:49 EST 2020 | avillaro2020

Hi, I need help on how to address the solder wicking on the samtec searay connector after reflow resulting to open solder joints on thick and thermal heavy PCB (4.4mm and 6.3mm). I increased my solder paste thickness to 8 mils, the connector is manua

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

IPC-J-STD 005 USER PERFORMANCE INSPECTIONS

Electronics Forum | Wed Sep 20 09:24:09 EDT 2017 | bstogsdill

Hi- I am attempting to determine if the "User Performance Inspections" on table 4-1 are required or are they just optional? Section 4 para 4.2 only refers to Qualification Inspection and Quality Conformance Inspections that are performed by the past

Re: Misalignment during reflow

Electronics Forum | Thu Nov 11 14:13:57 EST 1999 | Dave F

Thomas: From what you're telling us, you seem to be thinking correctly: 1 Paste should not spread appreciably in preheat 2 Something has changed, because you've not had this problem, until recently Two things to consider: 1 Has any thing changed

Mydata Users

Electronics Forum | Wed Apr 26 14:06:46 EDT 2006 | mdm4ua

Hi JEM, We just made the very same upgrade you are looking to make on three machines. We purchased a new MY12 and upgraded our other three (My9 W/hydra, My9 No Hydra, and TP9-2U) from 2.2.4C to 2.4.4c. There are several changes and most of the

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 17:50:01 EST 2000 | Dave F

Mike: It gets more humid in the winter? [I can see it�s true (not that I�d doubt you) cause I�m looking a a humidy map of the USA, right now] How does that work outin Californy? [Do the ocean breezes move the humid air in-land in the summer? Er w

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Fri Mar 07 15:20:11 EST 2003 | davef

O'Connor: IPC-A-610, section 12.4.4 SMT Soldering Anomolies - Nonwetting was added primarily to accomidate OSP boards. Heated flux is used to remove the 'lacguer'. So, you end-up with a copper colored border [or shadow] around the pads, where there

AIM SN100C Solder paste

Electronics Forum | Fri Apr 07 17:44:07 EDT 2006 | ratsalad

I still have half of a 500 g jar of this paste left. I'm going to give it another shot, but my first experience was not so wonderful. Everything was great until we reflowed it. Our profile matched AIM's recommendation, as far as I can see. The ch

Re: BGA Shorting problem

Electronics Forum | Tue Sep 01 10:16:10 EDT 1998 | Mike Cox

| | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | Our pad design is .020" diameter pads with .025" solder resist diameter. Th


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