Electronics Forum | Wed Aug 09 19:14:15 EDT 2006 | Board House
Our Manufacturing policy regarding welds is as follows. 1) Inner layers - depends on Core thickness and line width. Our shop will not do any welding on core thickness less then 5 mils. or line width less then 5 mil. Good AOI practices reduce the a
Electronics Forum | Thu May 18 11:16:16 EDT 2006 | russ
Go 5 or 6 mil thick with stencil, i am not familiar with that pitch but I would recoomnd a 5mil. Was the thickness in this post before and i missed it? Russ
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Fri Jan 24 08:14:24 EST 2014 | davem
m_imtiaz, Over the last 15 years or so I've found that using the stencil foil thickness +2mils/-0mils has worked very well. For example, if you have a 5mil stencil thickness your upper control limit would be 7mils and your lower control limit would
Electronics Forum | Tue Jan 23 22:21:15 EST 2001 | rpereira
We have evaluated 4 different AOI machines and the General Scanning 8200 machine was the best. Great G R&R. As far as paste height goes, it is very paste dependant. I recently completed a DOE comparing laser stencils to EFab, varying 0.5 mm pitche
Electronics Forum | Tue Mar 17 07:32:10 EDT 2009 | davef
Solder ball acceptance: IPC-A-610, 6.5.3.1 & 12.4.10. Solder balls: 5 ball system: * No more than 5 balls per square inch (100mm2) allowed * Solder balls can not be greater than 5 mil (0.005in) (100um) * Solder balls cannot be less than 5 mil (100um)
Electronics Forum | Thu May 20 16:22:07 EDT 2010 | remullis
I just got word from my board designer that the actual pad size is 11.8 mil and he is reducing the paste layer to 7.8 mil. To me this is way to much of a reduction. I am was accustomed to doing 20% reduction on any thing 20mil pitch or less. The scre
Electronics Forum | Mon Aug 08 18:59:49 EDT 2016 | oleksz
What should be solder paste stencil aperture proper size in comparison with PCB copper pad for lead free technology? When designing PCB foortprints I was using solder paste pad undersize of 2.5 mils (0.06mm) per side (solder paste pad size was 2.5 m
Electronics Forum | Tue Apr 12 04:37:52 EDT 2005 | chandran
1.Can anyone explain to me what is the clean and non clean solder? 2.What is the standard solder paste height spec for stencils 4mils,5mils and 6mils? 3.Whatis the meaning for ROHS?
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