Electronics Forum | Mon Dec 14 02:56:26 EST 2015 | s_marius
Good Day for Everyone! TOPAZ XII can handle 6.5mm height components easily. Is it possible to mount 10mm? The problem is that the picked high component pushes away other placed high component. Camera alignment works well. Please share your experien
Electronics Forum | Mon Mar 06 15:51:38 EST 2017 | bk
The one i've been using on some thermally diverse boards with great success has been henkel loctite mfr 301. It's alcohol based not quite the solids you are looking for but close it's 5.5-6.5 solids and it is no clean.
Electronics Forum | Tue Mar 07 07:26:43 EST 2017 | emeto
Thank you bruce! I tried similar rosin based 6.5% but it gives me a lot of residue. Anything water based?
Electronics Forum | Tue Jul 30 03:57:29 EDT 2019 | SMTA-David
Hi, I am looking for software for 2003 model 1707 EXL reflow oven (HC1 controller). I believe latest version for that model is 1.0.6.5.8 (98 Win) or 4.0.2.1 for XP. Thanks
Electronics Forum | Tue Oct 05 14:06:26 EDT 2021 | oclsc
Hi SMTnet. It is possible to reflow BGA's 0.65 pitch with a convection oven that only have heating zones on one side (topside) or is it a must to have heating zones on both sides in the oven (top and botton). Regards Ole C. Denmark
Electronics Forum | Fri Mar 30 23:35:43 EDT 2007 | mika
Question: Does this formula apply even for the small LGA:s like LGA36 6.5 x 3.5 x 0.6 mm pad size 0.35mm pitch 0.60mm? We use a 0.13 mm stencil thichess beacuse on the same board there is some P.I.P comps. The board dimensions is 35 x 50 mm on a pane
Electronics Forum | Thu Jun 01 21:19:52 EDT 2006 | ec
Hi Russ, Thanks for your input. Currently, our stencil is at 5 mil thickness and the paste height from 5.5 to 6.5mil. I have increase the paste height to 7 to 7.5 mil and great improve....... I just need some data to present to my management and tel
Electronics Forum | Fri May 29 10:21:06 EDT 1998 | Dave
| I'm in the process of doing an evaluation fora big board machine. My choices are Universal HSP 4791 and Fuji CP6-5. | Has anyone one a subjective evaluation on both machines? If so what was the outcome, abd experiences since installing the selected
Electronics Forum | Thu Feb 15 07:25:05 EST 2001 | Nick
0.5um(Ni~6.5um) after reflow(data taken in 48hrs).But after performing temperature cycle test ,the former aging rate(from the shear strength ) seems faster than the latter.Why!?Someone call this the 'precipitation hardness',but what actually is it! A
Electronics Forum | Sat Feb 28 08:15:50 EST 2004 | davef
J-STD-001 has what you need. 3.6 Facilities ......................... 4 3.6.1 Environmental Controls ........... 4 3.6.2 Temperature and Humidity ......... 4 3.6.3 Lighting ......................... 4 3.6.4 Field Assembly Operations ........ 4 3.6.5
