Electronics Forum | Wed Jul 25 12:58:04 EDT 2001 | BGA rework expert
A key factor is underside Pre Heater ----- Conceptronics makes the best in terms of IR Preheat----- Most machines have forced convection from the top and bottom --- the preheater is the key on larger more dense boards. Placement accuracy is also bett
Electronics Forum | Thu Nov 20 16:43:06 EST 2003 | frank
Oh, and we boil 5-sigma down to 2 out of 10,000 placements as a starting point. I don't know of a single machine that can do 1 million placements in one program. 10K is doable. If we fail there then we start looking at the bigger picture; either r
Electronics Forum | Thu Aug 11 15:00:45 EDT 2011 | gregcr
Hi All, We are thinking about adding a SPEA 4040 flying probe tester to our facility to add some flexability to our test capabilities. Does anyone have experience they could share on these units? I would be most interested in programming and overa
Electronics Forum | Wed Jul 04 12:22:07 EDT 2001 | davef
Several points: * Consider that your Cpk is probably different for both placing large and small components. * Probably your routine placement rate SB the speed you use to monitor the accuracy of your process. * Some people use a calibrated glass test
Electronics Forum | Mon Aug 21 18:13:19 EDT 2000 | Greg Jones
In Steve's last posting he wrote (in part): "I've decided that if KIC can recommend that profiling be done on unpopulated boards (how valuble is THAT??)" I contacted Steve off forum to discuss this. In the paper referenced by John Thorup (above),
Electronics Forum | Tue Jul 31 04:45:42 EDT 2018 | robl
Depends on what sort of outfit you are working for, and what you are building. A lot of CEMs are doing Flying Probe or ICT on the boards ahead of investing time building into units or adding parts that prevent access to rework. We have a combination
Electronics Forum | Tue Dec 18 08:09:32 EST 2001 | Stefan Witte
If you considering selling the machine, it will have a much lower value, if you can't demonstrate that the machine is still operational. If you don't have any jobs for the extra machine, I would study the machine performance. Write test programs and
Electronics Forum | Tue Jun 08 07:10:54 EDT 2004 | davef
Not quite what you seek, but as close as you're going to get ... 9850-K - Surface Mount Placement Equipment Characterization - KIT (Hard Copy & CD-ROM) ANSI Approved This standard has been developed to standardize the parameters, measurement proc
Electronics Forum | Fri Aug 08 13:21:14 EDT 2008 | RobP
With AOI it really depends on what you are testing. Not only what criteria, but what different types of components. We run a high volume low mix application for automotive checking for presense, positional accuracy, and all solder joints. We curre
Electronics Forum | Mon Jul 30 18:07:22 EDT 2001 | mparker
Kenny- there are a few standards by IPC and EIA that address the strength of solder. A pull test (which is a destructive test) will average 1500 PSI per joint. My concern is that you are wanting to increase solder volume for an 0805 component by inc
