ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-systems?con=t&page=1
) Process Equipment via Desktop and Stand-Alone systems up to fully automated In-Line solutions and as such the solution for all your Reflow Soldering, Heat Staking, ACF Laminating and Heat Seal Bonding applications
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/soldering
: Featured Name A-Z Name Z-A C-Quence - Automated in-line solution system With C-Quence™ Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and/or Heat Staking applications
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/bonding
: Featured Name A-Z Name Z-A C-Quence - Automated in-line solution system With C-Quence™ Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and/or Heat Staking applications
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-systems/c-prime
English Bond heads and thermode options English Interposer Modules and Tapes English Process Calibration Tools English C-Prime C-Prime Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-systems/c-slide
English Bond heads and thermode options English Interposer Modules and Tapes English Process Calibration Tools English C-Slide C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-systems/c-turn
English Bond heads and thermode options English Interposer Modules and Tapes English Process Calibration Tools English C-Turn C-Turn Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/heat-staking-systems
Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and/or Heat Staking applications
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/hot-bar-reflow-soldering-systems?con=t&page=4
. Soldering applications: Products Content Your results for: Hot Bar Reflow Soldering Systems Laminating Nordson DIMA The ACF material is supplied as a reel and consists of adhesive filled with conductive particles and a protective layer
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/heat-seal-bonding-systems?con=t&page=2
Heat Seal Bonding Systems DIMA Products Corporate | Global Directory | Languages Division Only All of Nordson Heat Seal Bonding Systems Heat Seal Bonding / ACF Final Bonding Once the ACF Laminating process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/hot-bar-reflow-soldering-systems
Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and/or Heat Staking applications
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