Electronics Forum | Wed Nov 26 12:44:55 EST 2003 | caldon
Dave- Mark Thaler is no longer at ACI/EMPF. He left a few Years Back. Best to use Guy Ramsey gramsey@aciusa.org 610-362-1200 x 107 Cal
Electronics Forum | Mon Mar 14 10:29:41 EDT 2011 | mosborne1
www.americancircuits.com. We can help you with these requirements. You can go from our contact us page or email us at ACI@americancircuits.com. Thank you, Matt
Electronics Forum | Mon Aug 08 10:06:23 EDT 2011 | blnorman
I thought there was a link for test labs somewhere on the site, but didn't see it in a quick look. Here are some I know of that should be able to run the test: Trace labs ACI Technologies (American Competitive Institute) STI Electronics
Electronics Forum | Thu Mar 14 12:23:13 EDT 2019 | jdengler
You could look at ACI Technologies http://www.aciusa.org. I have never used them but I see their "Boot Camp" advertised. Jerry
Electronics Forum | Wed Nov 11 10:15:28 EST 2020 | kierantennant
hi, I was wondering if anyone had tried to use a universal series 8 on a series 5 machine are they compatible? is there a way to make them compatible?
Electronics Forum | Thu Feb 22 10:32:25 EST 2001 | CAL
SCOTT- We do solderability testing for the electronics industry using a Multicore and Kester Wetting Balance testers. The standards we test to is IPC J-STD 002 for components and J-STD 003 for PCBs. There is also a system called SERA we co-developed
Electronics Forum | Fri Jan 30 09:29:22 EST 2004 | caldon
Joe- You confused me In the subject it has SMT and in a posting you say Through hole components. I was incharge of getting equipment for a research and teaching facility called ACI (Some know it as the EMPF). I was tasked with getting equipment at n
Electronics Forum | Sat Mar 03 23:24:55 EST 2001 | CAL
We test Parts and Components to IPC J-std-002/003. We also use a wetting Balance tester to determine solderability. We also test with SERA. We use ROSA to electrochemically revert the components back to their original state. Need more info ... email
Electronics Forum | Tue Mar 06 14:10:52 EST 2001 | CAL
Are the voids in the balls of a BGA? Are you verifying this through x-ray if they are? some voids depending on size and location are some what accepted. Solder paste type? Solder paste date code? Humidity high? PCB's been stored in a truck trailer?
Electronics Forum | Tue Apr 24 13:48:37 EDT 2001 | CAL
I would look at the pad to part ratio.Over sized pad geometry will give the component more room to move. I have also seen where the two pads that make up chip components are not symetrical nor complimentary.The pads should be equal in the X or Y dire
