Electronics Forum | Mon Oct 14 11:02:57 EDT 2002 | pjc
Can someone please point me to some good technical papers on the Ag Epoxy process covering- printing, dispensing, component placement and curing and on flexible & ridgid substrates too? Are there lots of you out there doing this process? Thx.
Electronics Forum | Mon Jan 20 03:59:27 EST 2003 | emeto
Hi Burb, I think you should try with paste which consist Ag.Or it might be other:Ag has different thermal characteristics, so you probably stay too long in the reflow zone.That's one reason for granular joints. good luck!
Electronics Forum | Thu Dec 09 09:29:24 EST 2004 | Joel Dudley
I'm hoping to find someone out there who has some no clean, 93.5 PB, 3 SN, 1.5 AG, .015 Diameter. If you have some and are willing to part with it please let me know.
Electronics Forum | Thu Dec 09 09:58:44 EST 2004 | davef
This is a perculiar alloy. Usually, the portions of each metal in the alloy sum to 100. Yours sums to 98. Could you be seeking 93.5Pb 5Sn 1.5Ag? It is more available.
Electronics Forum | Mon Feb 07 15:53:12 EST 2005 | John S
I ran across a description of a SnAgCuIn variant of lead free solder that melts around 195C. Has anyone used such an alloy? Is it widely available? I haven't seen it marketed widely. Thanks John S
Electronics Forum | Thu Mar 10 10:55:40 EST 2005 | Rob
Hi Jerry, Thanks for the info - it's very helpful. I'm assuming (as it carefully refrains from saying it anywhere!) that SAXC0307 is Sn99/Cu0.7/Ag0.3. Cheers, Rob.
Electronics Forum | Tue Apr 26 05:04:10 EDT 2005 | siverts
Sorry for my blackout, but here it comes: Solder paste: Senju 7100-GRN360-K1MK-VS Sn 95.5 Ag 3.9 Cu 0.6 Solder wire: Kester 24-7040-8834 Sn 96.5 Ag3.5 Regards,
Electronics Forum | Wed Jan 11 15:01:40 EST 2006 | Amol Kane
we have shortlisted Immersion Ag and Sn.....do you have any special storage conditions in yr facility for Immersion Ag boards?
Electronics Forum | Tue Mar 20 06:09:20 EDT 2007 | d0min0
Hi, can't find answer to my question on web - maybe someone can help would it be compatible to use a wire of Sn62Pb36Ag2 for a product made with Sn63Pb37 paste ??? regards
Electronics Forum | Wed Apr 18 04:22:43 EDT 2007 | ray
I facing dewetting problem on Ag/Pd termination(chip component)during reflow process. The solder wetting is pull to terminal side and exhibits dewetting. Any one ever face the same problem and any solutions for the problem?
