Electronics Forum | Mon Dec 15 18:22:36 EST 2014 | mcapizzi
As was stated, there are a number of variables that could come into play. I have used AirVac DRS26 and SRT Machines. We are now using Shuttle Star which has IR as well as hot air heat. This works much better for us. You can view these at. http://www.
Electronics Forum | Fri Apr 09 12:46:10 EDT 1999 | Bob Barr
I have been using an Air-Vac DRS-22 for almost two years with very good results. Once a profile is developed it is very repeatable. The DRS-22 is no longer available, however. It has been replaced by the DRS-24. Unfortunately, the DRS-24 has a lo
Electronics Forum | Mon Sep 28 11:30:14 EDT 1998 | Bob Barr
No, $60K is for the DRS-24 which has replaced the DRS-22. The 24 adds more bells and whistles, like motorized Z axis. I think they are pricing themselves out of the market, although I understand they are offering a stripped down 24 which is essenti
Electronics Forum | Mon Jan 27 12:27:03 EST 2003 | ksfacinelli
We have an assembly that requires a number of high density connectors to be placed after SMD. The process will not allow a normal wave solder setup due to the population of SMD comps. We cannot use a selective solder pallet due to profiles. We are
Electronics Forum | Fri Nov 22 12:34:14 EST 2002 | timreisenleiter
I am in the process of sourcing and ordering a BGA rework station. I only have exprerience with the OK-Industries (Now Metcal) BGA-3500 BGA rework system. Any experience/input on other comparable systems would be much appreciated (Pace TF3000, Air-
Electronics Forum | Fri Aug 20 13:00:16 EDT 1999 | ScottM
| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad
Electronics Forum | Fri Jul 16 19:31:18 EDT 1999 | Scott McKee
| I'm planning to introduce selective point-to-point soldering for pwb. This is due to various needs: PIHs assy on double IR, for example. I think the most suitable solution is a point-to-point soldering, 'cause we're still having small lot/many type
Electronics Forum | Tue May 11 12:02:03 EDT 1999 | Tony
| We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | All other tips are also welcome. | | Thanks | Philip, I have been doing BGA rework for
Electronics Forum | Tue Nov 20 19:56:12 EST 2012 | hegemon
In order to be able to do full prototype assembly, you will need to be able to mount and reflow a large number of different devices of differing technology. One part might be a simple QFP, another might be a .4mm pitch uBGA. If you are prototyping a
Electronics Forum | Thu Dec 04 10:59:02 EST 2014 | rrosera
HI, I work for a company in New England and recently had a unusually large number of boards fail after replacing a BGA on them. We use a AirVac DRS25 to remove and replace the BGA witch uses local forced hot air. We usually have at least a 90% s
