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Recurrent Neural Network-Based Stencil Cleaning Cycle Predictive Modeling

Technical Library | 2023-06-12 18:33:29.0

This paper presents a real-time predictive approach to improve solder paste stencil printing cycle decision making process in surface mount assembly lines. Stencil cleaning is a critical process that influences the quality and efficiency of printing circuit board. Stencil cleaning operation depends on various process variables, such as printing speed, printing pressure, and aperture shape. The objective of this research is to help efficiently decide stencil printing cleaning cycle by applying data-driven predictive methods. To predict the printed circuit board quality level, a recurrent neural network (RNN) is applied to obtain the printing performance for the different cleaning aging. In the prediction model, not only the previous printing performance statuses are included, but also the printing settings are used to enhance the RNN learning. The model is tested using data collected from an actual solder paste stencil printing line. Based on the predicted printing performance level, the model can help automatically identify the possible cleaning cycle in practice. The results indicate that the proposed model architecture can predictively provide accurate solder paste printing process information to decision makers and increase the quality of the stencil printing process.

Binghamton University

FINE LINE STENCIL Stays at the Top of the Industry with Its Technical Support Services

Industry News | 2008-06-13 16:32:11.0

COLORADO SPRINGS, CO � June 12, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, believes that customer service is key to staying successful in today�s industry. It accomplishes this with the help of its Value Added Technical Support Team.

FCT ASSEMBLY, INC.

An Analysis of SMT Solder Paste Printing Defects

Industry News | 2018-10-18 08:27:03.0

An Analysis of SMT Solder Paste Printing Defects

Flason Electronic Co.,limited

Symor ESD storage dry cabinet(Working principle)

Technical Library | 2019-04-08 23:21:29.0

Climatest Symor® adopts molecular sieve to dry air, the whole system is controlled by microcomputer, when humidity is high, It will start to absorb moisture,when the humidity reach the pre-set value, it will stop absorbing, and then discharge the water to outside the cabinet by heating,again and again by automatic control. The most effective and environment-friendly moisture-absorbing desiccant is molecular sieve, molecular sieve is the microporous crystal material synthesized by silicon and aluminium oxide. In order to keep the crystal net discharge to be zero, atoms with cations are located in the crystal structure.and the cation used in these synthetic crystals is usually sodium. At present, there are two kinds of molecular sieves widely used in the dry box industry: Class A and Class X. Molecular sieves are synthesized, shaped and activated under strictly controlled production processes. The whole controlled sythesis process can ensure consistency of the three-dimensional pore size. 3A molecular sieve pore size is 3 angstroms, 4A molecular sieve pore size is 4 angstroms; 13X molecular sieve pore size is 8.5 angstroms. The working principle of molecular sieve: Molecular sieves adsorb molecules onto the crystal surface by physical attraction force. Since 95% surface area of the molecular sieve is within aperture,it needs to screen the adjacent molecules by different size. Only small size molecules can enter into the inner adsorption surface of the molecular sieve through the crystal aperture. This selective adsorption phenomenon is called molecular sieve effect. The molecular sieve adsorption capacity and charge density (polarity) are further related to the adsorbed molecules. The molecular sieves can further distinguish which of the mixed molecules can be adsorbed and determine to what extent the charge density can allow the molecules to be adsorbed onto the crystal. Water molecules are particularly small (2.6 angstroms), that belong to highly polar molecules (very strong positive and negative electron density), and are easily adsorbed by molecular sieves, even under very low moisture condition,once the water molecules are adsorbed,they will be firmly fixed on the crystal. The environment-friendly moisture absorption device is equipped with molecular sieve. When it’s absorbing, the memory alloy controller is in tensile state, and the spring is in contractive state,which just make the valve contact the outer baffle, this insulates the outside air from inside dry box air to achieve dehumidification purpose; and after molecular sieve absorbed moisture inside dry box and become saturated, the program will automatically control the memory alloy device to shrink it so that the valve reaches the inner baffle position. Meanwhile, due to the shrinkage of the memory alloy, the spring is stretched and the valve is pulled out of the outer baffle,so that the moisture in molecular sieve will be discharged into the outside. after the dehumidifying process finished, the program automatically control and reset the memory alloy and spring,to restart absorbing status.

Symor Instrument Equipment Co.,Ltd

FCT Assembly Doubles Capacity with Acquisition of LPKF StencilLaser G 6080

Industry News | 2011-01-22 00:21:11.0

FCT Assembly has acquired a new LPKF StencilLaser G 6080 at its Memphis, TN facility. The laser enables the company’s Memphis operations to more than double its production capacity.

FCT ASSEMBLY, INC.

PACE IR 3000 Infrared BGA/SMT Rework System

PACE IR 3000 Infrared BGA/SMT Rework System

New Equipment | Rework & Repair Equipment

Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in

PACE Worldwide

Fine Line Stencil to Premier New Technologies and Company Updates at APEX 2008

Industry News | 2008-03-12 15:38:55.0

Fine Line Stencil invites visitors to stop by booth 243 at APEX 2008 to learn about its recent positive changes in technology. The APEX exhibition and conference is scheduled to take place April 1-3, 2008 in Las Vegas.

Fine Line Stencil, Inc.

Official PACE IR 3000 Tutorial - Install and Remove BGA and SMC

Official PACE IR 3000 Tutorial - Install and Remove BGA and SMC

Videos

"The IR 3000 offers advanced surface mount rework capability in an integrated, cost-effective, bench-top work station." This video covers the basic processes of the IR 3000, focusing primarily on: Installations, Removals, Component Alignment and Ins

PACE Worldwide

Stencil Technology for SMT production

Industry News | 2018-10-18 08:39:14.0

Stencil Technology for SMT production

Flason Electronic Co.,limited

ORIGINAL  ABB 3HAC128161  PLS CONTACT  Tiffany Guan:  plcsale@mooreplc.com

ORIGINAL ABB 3HAC128161 PLS CONTACT Tiffany Guan: plcsale@mooreplc.com

New Equipment | Industrial Automation

The best and most competitive parts! RFQ e-mail : plcsale@mooreplc.com Whats@app : +86 18030235313 Sales Manager : Tiffany Guan Skype : dddemi33    QQ :2851195473   Advanced technol

Moore Automation


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