Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Mon Jan 22 20:54:55 EST 2001 | davef
IPC-7095 - Design & Assembly Process Implementation for BGA's Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. This document
Electronics Forum | Mon Oct 18 20:06:27 EDT 1999 | Phuc Nguyen
I am researching a process call Collumn Grid Array for the BGA. Please email me if you have some knowledge about this process. The problem is ceramic BGA has different thermal coefficient with PCB (FR-4) material, and in extreme temperature (-40 C-
Electronics Forum | Mon Jul 30 10:53:11 EDT 2001 | marys
What are the advantages to using a flexible pin array support system?
Electronics Forum | Thu Sep 10 11:54:53 EDT 1998 | Kelly Morris
OOOOOooooooopppppsssss!!!!!!! I need to generate this question elsewere .... your site is great!!! James
Electronics Forum | Fri Nov 30 15:27:19 EST 2001 | Rex Gustafson
Where can I find pcb scoring guidelines for boards with different thicknesses, panel arrays, ....?
Electronics Forum | Thu Jul 25 14:05:12 EDT 2002 | Bordiky
I've been reading the forum here for a few weeks and found some helpful material from talented individuals. Now, I have a question(s). I'm looking into different alternatives for doing X outs. Right now I'm familiar w/ two of them:1. Bad Board Mar
Electronics Forum | Wed Jan 26 08:23:51 EST 2005 | davef
Look here: http://www.pcbexpress.com/stencils/stencil_article_page1.htm
Electronics Forum | Fri Aug 18 09:02:49 EDT 2006 | russ
PBGA is Plastic Ball Grid Array. Russ
