Electronics Forum | Tue Sep 10 09:56:21 EDT 2002 | gregp
I wish I knew where Mr. Fastek worked so I could contact his customer base to tell them his company may not be here in 6 months. I don't know where you get your information but you are reckless with it. These forums should be based on experiences a
Electronics Forum | Thu Aug 28 16:13:06 EDT 2003 | Dan Gosselin
Thanks everyone for your help. I have since found a good article I am downloading of of the SMTA website. Dan Title : EFFECT OF SURFACE TENSION OF SOLDER ON UNDERSIDE DEVICE SUPPORT DURING REFLOW OF A PCBA Author : Mulugeta Abtew Author Company
Electronics Forum | Mon May 29 04:02:51 EDT 2006 | vasily
Hi Efren Unfortunately I cannot say about prices, because I don't know them in your region. But I can offer you to consider the world-leader manufacturers of each type of equipment. I think you can obtain all information through their web-sites. We s
Electronics Forum | Tue Apr 05 10:36:24 EDT 2011 | frcdave
Hi Don, The YESTech B3 can be used post placement very easily. I would suggest contacting their service team, they could walk you through the process quickly. You are actually very close to being able use it now in that capacity since you have the i
Electronics Forum | Wed Oct 12 10:55:16 EDT 2016 | hken
Like many other circuit assemblers we cross reference an incoming reel of components Manufacturers PN (MPN) to our company’s Internal Part number (IPN). For years I've been scanning the MPN & Qty on the manufacturers label and using a simple database
Electronics Forum | Wed Aug 10 04:15:01 EDT 2005 | vinitverma
Ari, I would suggest you make a checklist of all your requirements (not just large scale production) and prioritize them with weights assigned to each. Fill in the checklist for each equipment and manufacturer and you'll have the results out. I wou
Electronics Forum | Wed Dec 03 06:04:10 EST 2014 | spoiltforchoice
Manual placement aids are often very similar, I would suggest it is quite difficult to tell them all apart. Most of them include some kind of carousel for bins of loose parts and have the option of a few tape "feeders". If you are building small volu
Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076
https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting
Electronics Forum | Sun Apr 05 18:59:15 EDT 1998 | Graham Naisbitt
Jaqueline There are so many variables in the electronic assembly manufacturing process involving more than 12 different chemistries, that it is impossible to easily identify and determine the nature and reason of such residues. GEC Hirst Research in
Electronics Forum | Tue May 23 17:49:07 EDT 2006 | flipit
Hi, Ok I have some numbers for you on my process. For the last 2 years we have been placing 4 BGA on a 2" X 5" X 0.062" PCB. The BGAs are 16X16 256 ball, 15X11 165 ball, 8X8 64 ball, and 26X26 456 ball. The 8X8 is 0.8mm pitch and the others are 1
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