Electronics Forum | Mon Nov 20 21:02:46 EST 2000 | Michael Psrker
First question I have for you is: Are you assuming that standard precautions are in place at your facility to minimize moisture content i.e. air- deionizers, vacuum sealed packaging, humidity control in storage and manufacturing? You do not mention
Electronics Forum | Tue Jun 16 15:01:58 EDT 1998 | Gary Simbulan
There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior
Electronics Forum | Tue Jun 16 15:00:12 EDT 1998 | Gary Simbulan
There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior
Electronics Forum | Mon Jun 08 15:29:17 EDT 1998 | Gary Simbulan
| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil
Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan
| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil
Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto
This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.
Electronics Forum | Thu Sep 30 11:30:46 EDT 2010 | babe7362000
Take a few parts from the reel and look close at > the parts to make sure the bottom surface of the > leads is below the bottom surface of the body. Yes I did that and they are below the body. I found the problem I think. The solder mask is abo
Electronics Forum | Thu Aug 21 16:00:31 EDT 2014 | davef
This links to a NPL presentation on moisture removal from PCB http://www.npl.co.uk/upload/pdf/20140318_effect_baking.pdf Consider: * Focusing on preventing moisture contamination of boards, rather than removing moisture * There will be no standard
Electronics Forum | Thu Jun 24 04:38:31 EDT 1999 | Vinesh Gandhi
Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody help
Electronics Forum | Mon May 16 15:29:53 EDT 2005 | jdumont
We have the exact same issue with out 456 ball Xilinx parts. The corner balls either do not touch or are so stretched out that they are intermittant. I believe this to be a moisture ingress problem. Ive been setting up our little batch oven this afte
