Electronics Forum | Thu Mar 09 05:44:07 EST 2000 | Wolfgang Busko
Hi Edmund, J-STD-013 "IMPLEMENTATION of BALL GRID ARRAY and other HIGH DENSITY TECHNOLOGY" should be a great help for you. Component manufacturers ( try Motorola via Internet) also give good advice. For the DFM aspects get in contact with your asse
Electronics Forum | Tue Apr 11 08:57:35 EDT 2000 | Alfred
Can you get me a recommendation regarding a Micro BGA soldering. It is apparent there is a problem and I want to insure success by following recommended practices. Is there a particular solder mask configuration recommended, as far as stencil thick
Electronics Forum | Wed Mar 29 09:39:45 EST 2000 | JAX
Garo, Minor voiding in Ball Grid Array solder joints is common, and not considered a threat to reliability. The biggest cause of open solder joints caused by voids is the outgassing of moisture. They are formed when pockets of gas are trapped durin
Electronics Forum | Thu Mar 09 05:44:07 EST 2000 | Wolfgang Busko
Hi Edmund, J-STD-013 "IMPLEMENTATION of BALL GRID ARRAY and other HIGH DENSITY TECHNOLOGY" should be a great help for you. Component manufacturers ( try Motorola via Internet) also give good advice. For the DFM aspects get in contact with your asse
Electronics Forum | Tue Oct 19 22:27:29 EDT 1999 | Stu Leech
We have just completed some studies of with ABPAC, who is a large subcontract assembler of plastic ball grid arrays. BT laminates can pick-up appreciable moisture in just two hours. They are using TVP demoisturizing, our product (I apologize for the
Electronics Forum | Thu Sep 10 11:57:20 EDT 1998 | James Michaud
I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress reli
Electronics Forum | Fri Sep 11 00:52:19 EDT 1998 | Rick Thompson
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Mon Mar 04 09:45:11 EST 2002 | Andrew H Otwell
Thanks Cal, for your comments. I'm specifically working on ways to improve how search results are presented, since we're building a very large product database. In particular, I'm implementing ways that search results can behave more like librarians:
Electronics Forum | Mon Jul 12 16:33:10 EDT 2010 | davef
Ideas to follow are: * Review IPC-7095 BGA Process Implementation * Look here: http://www.smtinfo.net/Db/_Ball%20Grid%20Arrays.html
Electronics Forum | Mon Jan 13 18:22:55 EST 2003 | davef
100 sec) and decrease reflow temp to 205C. * Understand that voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherw
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