Electronics Forum | Fri Aug 24 11:03:15 EDT 2007 | hussman
I agree with Joris. But to add to his comment, the type of finish also has a direct affect to your wave solder process. Going from a gloss finish to a matte finish may help a lot. As for humidity affecting your wave - I doubt it. I use a water
Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon
| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | I
Electronics Forum | Thu Nov 02 04:42:48 EDT 2023 | tinaheussaff
In general, it is safer to use a single alloy with a known composition and performance characteristics. If you need to change the alloy used in your selective soldering machine bath, it is advisable to consult with the manufacturer or a soldering exp
Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung
Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass
Electronics Forum | Mon Feb 19 11:36:39 EST 2001 | billschreiber
Hello Mark, I wish it were that simple so I could direct you to a particular manufacturer and stencil cleaner model. Unfortunately, there are several issues complicating the process of cleaning all these applications in one machine. First and fore
Electronics Forum | Tue Apr 24 11:28:34 EDT 2001 | Barry
Anyone have any specific knowledge of SMTECH 100 i S machines and the pro's and con's. Does the machine capability rank as good bad or indifferent within the industry?
Electronics Forum | Fri Aug 23 18:51:00 EDT 2002 | edahi
weve done a few evaluations for the no-flow underfill and for the reliability I think it has already passed MRT L3 @ 220C reflow. What is it specifically you're interested about the flow u/fill??
Electronics Forum | Tue Sep 23 10:22:40 EDT 2008 | kumaravelu
Is there any specific method or product available to implement FIFO system. Currently we stack all the D/C in a shelf and we don't have a method to pull the latest D/D first. I would appreciate any help in this regard. Sundaram
Electronics Forum | Wed Nov 12 09:39:11 EST 2008 | markhoch
Thanks Dave! I'm fighting the very same battle. Specifications are sparse on the subject, but you offer a very viable solution. (As usual!)
Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos
What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank
