Electronics Forum | Wed May 12 07:53:28 EDT 2004 | solderpro
Lets make it easy on the poor guy, some are correct, check you profile but remember one thing most do not apply, it is important to match the type of paste you are using with the style of oven and configuration. send a direct email and I will give so
Electronics Forum | Tue Nov 12 09:04:21 EST 2019 | mario85
Hello Guys, I'm new here. I am smt process engineer in new company located in Poland. I am responsible for whole smt line, so I have a lot of problems at the beginning :). I would like to ask about few things. The topic is solder balls. I produced s
Electronics Forum | Thu Feb 08 09:07:22 EST 2001 | Hussman
OK, without knowing the specifics, why does everyone blame the oven? Most solder balls occur around R's and C's in almost every shop I've been to. The best place to start looking is the screen printer - not the oven. Sure the oven is the last proc
Electronics Forum | Tue Nov 19 21:38:39 EST 2019 | zack
Hello, The first thing that you need to do is to make process mapping about this incident, so you can exactly determine all factors and observable changes happened during 2 weeks of timeline difference. According to my experience, if all equipment
Electronics Forum | Thu Jul 12 10:32:59 EDT 2001 | Hussman
Wow, what a string of answers and nobody brought up the easiest way to eliminate solder balls. Yes, the paste being squished under the part does reflow and work it's way out to the side during reflow. I did a 5 week study on this (when I was a bori
Electronics Forum | Thu Jun 24 02:31:24 EDT 2004 | yukim
Currently we are having a lot of solder balls, after a few hours of continous production. This is how we work: load new solder paste at the beginning of the shift, less than 500grms. Then, the operator loads new solder paste periodically, every 3 to
Electronics Forum | Mon Jul 16 21:25:26 EDT 2001 | davef
Sure, use of U-shape apertures is another way to reduce the amount of paste that you apply. That and similar schemes mentioned in the article are not a function of the flux used. We have used U-shaped apertures for MELF and mini-MELF. They are sug
Electronics Forum | Wed Aug 31 12:49:04 EDT 2005 | kmeline
I have been having the same problem with the LLP. I have three stencil I have done reduction on. The first I went by the manufacturing recommendations. The last two I have done more reducing for the thermal pad. The last one was at a 20% reduction an
Electronics Forum | Tue Nov 27 12:12:53 EST 2001 | Justin
We have noticed that when you are using a no-clean flux with the wave solder process that you will have additional solderballs. One thing that we have done is to change the PCB finish to a matte finish. This has greatly reduced the number of solder
Electronics Forum | Fri Mar 25 05:33:18 EDT 2011 | Nigel, RAKON
We have the occasional solder fine but the main issue I have is with small - large balls of solder around an 0402 capacitor. Our LF paste data sheet states a %rH of 25 - 70, I have recorded an average for March of 14.9 - 38.5 %rH. Every other requirm
