Electronics Forum | Mon Jun 12 17:03:21 EDT 2006 | pjc
Its in the IPC 600 bare-board specification.
Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe
Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed
Electronics Forum | Tue Mar 25 09:35:28 EDT 2014 | emeto
Have you tried to bake the boards before you process them?
Electronics Forum | Tue Mar 25 10:31:05 EDT 2014 | sara_pcb
The boards are baked for 2 hours at 120 deg C Regards, R.Saravanan
Electronics Forum | Wed Jun 21 19:01:48 EDT 2017 | mac5
Try baking the boards; you may have a moisture problem.
Electronics Forum | Tue Mar 25 11:43:48 EDT 2014 | sara_pcb
It is Solder Mask on Bare copper, The land finish is HASL as per MIL-PRF-55110G which accepts trace of HASL as acceptable. Wetting is acceptable. regards, R.Saravanan
Electronics Forum | Fri Feb 23 08:56:21 EST 2007 | russ
I persoanlly have noticed issue with either method, only time I run into issues with trays is when they get baked at too high of temp and warp. Russ
Electronics Forum | Mon Jan 12 02:56:42 EST 2009 | sachu_70
Hi Bill, You should try pre-baking any such old devices prior to using on SMT Reflow. Refering to MSL-type3 guidelines could help in your case.
Electronics Forum | Fri Dec 11 13:06:54 EST 2020 | johndep7
I haven't, that is a good idea, I was reading about the chance of that earlier but I was not sure. The best way to eliminate is to bake the board?
Electronics Forum | Mon Nov 20 04:04:42 EST 2000 | Gyver
Sirs, Please do me a favor to answer the following questions, thanks a million! 1. Will the baking of BGA or PCB cause more oxidation before the SMT process? 2. What is the acceptable Life Time of solderability at customer site? The time that the sol
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