Electronics Forum | Wed Sep 15 11:08:45 EDT 1999 | Dave F
| I am looking for help on doing smt equipment qualifications. I need to find some examples to follow. The equipment to be qualified is a Stencil Machine, Pick and place machine, and Reflow oven. We manufacture medical devices so it has to be somewha
Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F
| I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from | year 2000. Can anyone tell me if this is true | Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release
Electronics Forum | Mon Jun 12 17:03:21 EDT 2006 | pjc
Its in the IPC 600 bare-board specification.
Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe
Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed
Electronics Forum | Tue Mar 25 09:35:28 EDT 2014 | emeto
Have you tried to bake the boards before you process them?
Electronics Forum | Tue Mar 25 10:31:05 EDT 2014 | sara_pcb
The boards are baked for 2 hours at 120 deg C Regards, R.Saravanan
Electronics Forum | Wed Jun 21 19:01:48 EDT 2017 | mac5
Try baking the boards; you may have a moisture problem.
Electronics Forum | Tue Mar 25 11:43:48 EDT 2014 | sara_pcb
It is Solder Mask on Bare copper, The land finish is HASL as per MIL-PRF-55110G which accepts trace of HASL as acceptable. Wetting is acceptable. regards, R.Saravanan
Electronics Forum | Fri Feb 23 08:56:21 EST 2007 | russ
I persoanlly have noticed issue with either method, only time I run into issues with trays is when they get baked at too high of temp and warp. Russ
Electronics Forum | Mon Jan 12 02:56:42 EST 2009 | sachu_70
Hi Bill, You should try pre-baking any such old devices prior to using on SMT Reflow. Refering to MSL-type3 guidelines could help in your case.
