Electronics Forum: being and ovens (Page 4 of 79)

solderability and hasl thickness

Electronics Forum | Fri Sep 12 13:14:33 EDT 2003 | Mark Kostinovsky

A little adition to Norm's statement: Sn-Pb intermettalic compounds do not accept solder as they are (even without being oxidized).

NADCAP and thermocouple calibration

Electronics Forum | Wed Aug 07 16:49:15 EDT 2013 | hegemon

You mean you don't pull all of your thermocouples out of the ovens once a year and send them out for calibration? - lol Tough question. You have a calibrated datalogger. (I assume) You have an oven with preset zone temps, each zone controlled by a

Touch-up and Inspection Process

Electronics Forum | Thu Mar 03 09:04:26 EST 2005 | russ

Been following this thread and have a question, Why do "touch-up" people follow different criteria than "Q.C." people. It sounds like the root of the problem is not addressed but bandaids are being put into place. We have no "Q.C." department and

Conveyors and bar code

Electronics Forum | Wed Aug 23 14:59:32 EDT 2006 | bill

I�ve been lurking on the forum for a while so I will take a stab at this, mainly because there is no answer I take it that you have a variety of boards being produced at the same time and are in fixtures so the conveyors don�t need to be adjusted, a

BGAs and vapor phase

Electronics Forum | Fri Jul 16 15:30:22 EDT 1999 | SMTASSY

Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still thi

Skewed and popped components

Electronics Forum | Fri Sep 26 12:57:09 EDT 2003 | Angie

We have had some components that popped off in our IR oven. It was attributed to the solder paste. The humidity was above 60% the temp was about 70 degrees.

Immersion gold and BGAs

Electronics Forum | Wed Aug 31 12:33:25 EDT 2005 | Jaya

I have expirence running,double sided Imm gold boards recently which ed up a lot of solderability issue. The Imm gold need to be slightly more control during reflow oven area on it's profile.

Wave and Reflow Profiler

Electronics Forum | Tue Feb 19 07:44:41 EST 2008 | tonyamenson

So just to clarify.... If i bought a KIC 2000 I could run that one unit over both my waves and through both my ovens (leaded and lead-free)? Or would I need additional equipment to use it on the wave?

NADCAP and thermocouple calibration

Electronics Forum | Wed Aug 07 12:35:36 EDT 2013 | cyber_wolf

I was asked how we verify that the thermocouples INSIDE the reflow oven are calibrated. That seems pretty impractical to me. Has anyone come across this ?

Flexi boards and uBGA

Electronics Forum | Thu Jul 06 13:36:37 EDT 2006 | SWAG

We've had much trouble with flex circuits. As previously mentioned, you must have local fids for the board or the BGA itself (if panelized). Other troubles we experience are drilled holes for pinned connectors. Unless the PCB manufactur has some w


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