Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto
This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.
Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto
We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top
Electronics Forum | Tue May 17 10:01:42 EDT 2005 | russ
I have had the same problem with this supplier, we found that one mfg. place or process used a .015" piece of FR4 as the base while others had .030" Fr4, We discontinued use of the .015" and never had a problem again.
Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef
We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats
Electronics Forum | Tue Aug 11 17:36:44 EDT 2009 | dyoungquist
You are looking for a complete SMT assembly line plus possible X-Ray inspection and rework equipment. The 3 components of the SMT line are stencil printer, pick-n-place machine and reflow oven. How small are your components? 0603? 0402? What is the
Electronics Forum | Mon May 16 15:29:53 EDT 2005 | jdumont
We have the exact same issue with out 456 ball Xilinx parts. The corner balls either do not touch or are so stretched out that they are intermittant. I believe this to be a moisture ingress problem. Ive been setting up our little batch oven this afte
Electronics Forum | Tue May 17 08:00:26 EDT 2005 | Bob R.
We went through this with one PBGA supplier recently and they were able to get the problem under control by fixing some of their molding processes that were inducing residual stresses. You can really see it in a thermal moire where you measure warpa
Electronics Forum | Tue Aug 18 10:17:15 EDT 2009 | grantp
Hi, You don't need X-ray and all that crap. I would get an old MYDATA TP9 or something like that, and a manual stencil printer and a batch oven or a small inline oven. Should do the trick and be very low cost. Should be simple to use as well. Tha
Electronics Forum | Fri Aug 07 07:44:56 EDT 1998 | Earl Moon
| | | No sour grapes, | | | This has gone on too long. I expect no free advertising, nor do I seek it. It is clearly understood Bob is an industry leading consultant. What is not understood, at least by me, how he is allowed to "advertise" so freely
