Electronics Forum | Thu Nov 01 22:32:57 EDT 2007 | lvzhu
CSP has pillow, the BGA's ball doesn't combination with the solder paste. also ,the 0402 chip aftet the oven ,the surface looks like many tin ball pile together. how solve this problem. thanks for your discuss.
Electronics Forum | Tue Dec 23 01:23:45 EST 1997 | J.H Kim
I'd like someone gives me a tip for elemating of voids in the mico BGA solder joint and the method of inspection of them, very exactly.
Electronics Forum | Mon Nov 15 14:24:17 EST 2004 | nrocco
Im looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching
Electronics Forum | Thu Jan 14 23:49:00 EST 1999 | Wirat Sriamonkitkul
I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? Thank you, Wirat S. / Jan 15
Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS
IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa
Electronics Forum | Mon Aug 23 16:37:22 EDT 2004 | Terry
Three methods, all work, all require generous use of flux. 1.) Use a heated, electrical desoldering tool with flux. Just be sure that you select a forgiving desoldering tip with a rounded tip end to it so that you do not scratch the pad. Advantage:
Electronics Forum | Mon Apr 12 15:52:12 EDT 2004 | wgaffubar
I am using Indium 92J type 4 solder paste due to a BGA site with .008" pads and stencil opening of .009" square and .005" stencil thickness. When I try the type 3 we get insuffecient print. The aspect ratio tells me that I should be using a type 4. T
Electronics Forum | Tue Feb 27 20:17:19 EST 2007 | roderickray
I have been trying to tell people at work that minor scratches on solder resist on BGA will not effect functionality of BGA, instead they want to attempt repair of these scratches. Any suggestions.
Electronics Forum | Thu Jul 15 15:55:41 EDT 1999 | nards penalosa
| | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec d
Electronics Forum | Thu Jul 15 12:26:56 EDT 1999 | Earl Moon
| We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwe
