Electronics Forum: bga top and bottom (Page 4 of 25)

Micro Solder Balls and Vias bridging Issue

Electronics Forum | Tue Mar 03 03:11:57 EST 2015 | vb7007

Hi I also forgot to mention, top side is reflowed first at SMT. Tenting vias is good option. we are looking into it. Can you please also suggest any solution to avoid solder balls at bottom side in other places than vias. Thanks

Re: uBGA rework and X-Ray inspection

Electronics Forum | Sun Apr 16 14:37:25 EDT 2000 | Roberto Navarro

Hi, I work for Nortel and here rework BGA'S we use DRS22 rework station and CRT 2000 X-ray inspection. The main problem is put again the BGA on the PCB because you need reboling the PCB and you could damage the soldermask. Talking about Air-vac is ve

Clearance between Through hole and chip component

Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin

Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole

Required humidity for SMT production and storage

Electronics Forum | Thu Apr 12 13:04:47 EDT 2007 | slthomas

Handling requirements of all classifications of moisture sensitive devices is found in J-STD-033. It really isn't an issue for most parts unless they're going to reach reflow temperature again, which is unlikely unless you're removing a nearby compo

Cleaning prototype PCB assemblies and waste water

Electronics Forum | Wed Jun 20 11:39:56 EDT 2007 | realchunks

That's like asking the IRS to do your taxes for ya. Once they're in your building, they will not leave until they go thru top to bottom. Remember, EPA Field Investigators are "supposed" to find things wrong. They may not find any thing wrong with

Generating pick and place file in GC-Powerplace

Electronics Forum | Sat Sep 29 19:04:13 EDT 2012 | e_music

Hello, I have just installed the demo version of GC-Powerplace. Could anyone here walk me through the process to generate pick and place file from gerbers? I don't have solderpaste layer. All I have got is signal layers (top/bottom), soldermask, sil

Selective soldering pallets and solder balls

Electronics Forum | Tue Dec 10 14:10:38 EST 2002 | Randy Villeneuve

Steve, I wave solder most if not all our boards with selective wave pallets. I did not catch if the solder balls were on top of the board or on the bottom but that will make a difference on what to do to get rid of them. Pallets are good and bad. On

Re: qfp and soic joint Problem

Electronics Forum | Mon Apr 17 19:30:27 EDT 2000 | Boca

All of the above is good stuff. To add, I have seen this several times if the assembly is wavesoldered. Heat from the wave can partially reflow the top side SM solder joints and weaken them. To test, check joint strength before wave and then after

Wave Soldering and Through Hole Forums

Electronics Forum | Thu Jan 24 13:23:53 EST 2002 | Shawn

Thank you all very much for the responses. The solder is eutectic and the problem, as far as I can tell, has been around before I was here, 2+ years. The flow machine is a treiber with 2 bottom preheaters and 1 top. The solder pot temp is 500F +/-4F

Compressor for Pick and Place line

Electronics Forum | Wed May 20 16:07:22 EDT 2020 | stephendo

You want a big enough storage tank to smooth pressure. Figure out what size pipes you need and go a size bigger. Make a loop of the pipes with shut offs. That way you can shut down any section and still have air to the rest of the air line. Run the p


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