Electronics Forum | Thu Aug 21 12:31:54 EDT 2003 | adlsmt
I have some finished boards that I have concluded have "black pad" defect. Outside of the black crap on some of the solder joints, if the boards are electrically functional, are they reliable? Any opinions would be appreciated as I dont want to throw
Electronics Forum | Thu May 05 15:25:38 EDT 2005 | jimmiem
Would a lesser degree of black pad still allow solderability as i seen in my case?
Electronics Forum | Tue Jun 13 04:42:26 EDT 2006 | yqdeng@gsl.com.hk
What is "Black pad"in ENIG(Electroless nickel/immersion gold), how to solve if it happen in SMD BGA solder joint?
Electronics Forum | Mon Jun 19 05:00:17 EDT 2006 | YQ Deng
Thanks very much! In fact, "Black PAD" phenomenon have been found in our product, the total BGA came off PCB during drop test. if we apply the underfill to BGA after SMD process, Could the underfill add reliablility of product?
Electronics Forum | Tue Nov 14 05:16:33 EST 2006 | pavel_murtishev
Good afternoon, Yes, it is to be expected. This is well known �black pad� issue. Google �black pad�, for example: http://doc.tms.org/ezMerchant/prodtms.nsf/ProductLookupItemID/JEM-0109-1262/$FILE/JEM-0109-1262F.pdf?OpenElement BR, Pavel
Electronics Forum | Tue Dec 05 21:19:14 EST 2006 | Jack
Hi Doug, I think you are right..Let me do some EDX on other location to see any nickel oxide...BTW, is this black pad reworkable?? If yes, how? Thanks in advance,..
Electronics Forum | Mon Aug 11 13:55:09 EDT 2008 | guhansub1
Your defect may be possibly due to black pads, although it is rare on component side. Is your BGA pad finish ENIG? If so, inspection using a SEM can give clues on the presence of black pads
Electronics Forum | Thu Jun 30 03:14:34 EDT 2016 | andrzej
Looks like "black pad" issue. More about this here: http://www.ipc.org/feature-article.aspx?aid=Black-pad Definitly PCB supplier need to improve the process.
Electronics Forum | Mon Oct 20 17:03:05 EDT 2008 | davef
Josh From looking at your pix, we don't have a clue. [And we're going down to the nurse's station to get our eye checked because we don't black bubkus.] More than anything else the: * White on the pads could be solder * Copper-penny brown on the pad
Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef
Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri