Electronics Forum | Fri Jul 28 09:33:14 EDT 2006 | pavel_murtishev
Oven is controlled properly. We run a lot of products at this line. Moreover, same problem appeared at other production line (ovens are different). Yes, problem is new; I never saw this defect before. BR, Pavel
Electronics Forum | Fri Jul 28 11:48:55 EDT 2006 | Rob
Sorry Chunks! Not really with it - Friday afternoon, with 10 minutes to go. From experience I'd go with termination coating problem, linked a a few values, as they batch coat by value - so a 220R may be affected, but not a 100R.
Electronics Forum | Sat Jul 29 08:52:09 EDT 2006 | davef
This recipe is nice for leaded soldering. The time above liquidous plus 20*C is too short for mixed alloy soldering. Remember all that nonleaded stuff that you add to the solder acts to increase the liquidous temperature of the alloy. Try slowing
Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef
You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.
Electronics Forum | Mon Oct 26 12:40:08 EDT 2009 | awtm
pls find attached photo from Supplier saying that the failure at pth hole was due to blistering caused by moiture evaporate rapidly resulting delamination occur on FR-4 material from an old PCB (3yrs). Pls advise if attached picture confirms such co