Electronics Forum | Sat Jul 29 09:01:08 EDT 2006 | davef
Well, a "reflothermal recipe" is a typo. It should read "reflow thermal recipe". Sorry for the confusion. Most people call this THE PROFILE. We think a profile is the output of a profiler when it portrays the result of a reflow recipe. We're gue
Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele
I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar
Electronics Forum | Wed Feb 21 08:06:23 EST 2007 | davef
The cause could be a lot of different things. As long as you didn't use excessive reflow temperatures, we'd guess that: * Solder mask blister: Your board fabricator should be able to demonstrate through TMA [or equivalent] analysis that the mask wa
Electronics Forum | Mon Feb 23 05:37:23 EST 2009 | emmanueldavid
Necoleta, PWB Blistering/De-lamination may not be due for Titanium finished threads / holders which is typically being used to draw high Shelf Life of Pallets and even flow across Auto Wave Soldering rails. There is also nothing to suspect on Liquid
Electronics Forum | Tue Mar 30 20:04:19 EST 2004 | Ken
If speed is truly an issue, migrate to no-clean. However, this is not always an option. Why bake after 1st smt pass? Because you are probably not drying completely under the BGA components, and/or you are pushing water into the parts/boards/ vias
Electronics Forum | Fri Aug 21 04:43:14 EDT 2009 | ghepo
Hello, I suggest you visit the website http://www.analysispcb.com, where I found these information : PARAMETERS FOR DOUBLE “V” SCORING LEAD FREE LAMINATES Typ WEB Thickness, 1.6mm : 0.38mm (+.15/-0) "...Tg is not a good indicator of a materials’
Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech
Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro
Electronics Forum | Thu Jul 28 05:41:22 EDT 2005 | K
Hi guys, Have any of you encountered harwin connector M80-647 in the past? Have you noticed any problems with the reliability of the component, solderability and 'reworkability' (thats a new word for sure)? Heres a PDF of the component; http://www.
Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55
Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D
