Electronics Forum | Fri Jan 07 07:36:14 EST 2005 | dansmall
I have a Polyimide board that is showing signs of de-lamination. I was wondering what pre-bake times and temperatures other people would recomend for new boards as well for boards that have been on the shelf for 8 months.
Electronics Forum | Tue May 24 10:37:53 EDT 2005 | pr
Topline sells kits with the dummy components and the boards. They will also give you the CAD DATA for the placements on the board. You can also use these as "gold boards" to check placement accuracy and machine repeatability. http://www.topline.tv
Electronics Forum | Wed Jul 13 10:43:16 EDT 2005 | james
I dont have much choice because the vaccuum is right underneath the whole board, it sucks the board fairly hard. The only thing holding the board is the vacuum and board supports.
Electronics Forum | Wed Aug 10 16:04:09 EDT 2005 | rrylande
I am concerned about delamination and other modes of damaging the board itself. Am I mistaken to believe that raising the entire board to near reflow temperatures (during the repair of a single BGA) may damage the quality of the board?
Electronics Forum | Wed Aug 10 17:02:32 EDT 2005 | Inds
wats the thickness of your board.. and the dimension.. I would not heat the board beyond 150deg C.. coz if the board is thick and large.. it will take a long time to reach that temp..and you will burn off your flux.causing poor solder joint. Ind
Electronics Forum | Fri Aug 25 07:42:29 EDT 2006 | davef
Our sympathies about the ENIG boards. B:) So, you cut the end off the barrier bag, take 200 boards, heat seal the end of the bag and restock it, build the 200 boards and ship them, right?
Electronics Forum | Thu Jun 14 16:31:38 EDT 2007 | aj
I concur Chunks ! A simple test to carry out is the Z0 height check across the board, with particular attention to the area of the board you are having problems. You should at least see the nozzle touch the board , ideally press the board slightly.
Electronics Forum | Fri Aug 24 10:22:35 EDT 2007 | frodriguez
Did you check your board finishing? If you are using ENIG finishing on your board you may have a Black Pad issue which causes BGA falling apart from the board
Electronics Forum | Tue Sep 18 12:44:38 EDT 2007 | hussman
Simply ask your board manufacturer to Hot Air Solder Level the boards. HASL is a very common procatice at all board houses. Should not add cost and now your board meets this spec before you even touch it.
Electronics Forum | Wed Oct 31 10:30:30 EDT 2007 | wayne123
I only ever change board when the board layout is changed. I too have boards that are, well, not so pretty. but they work for profiles. Wayne
