Electronics Forum | Sat May 26 02:45:38 EDT 2007 | bryanhanton
We are in the market for a 4684A TAB bonder. If anyone knows where 1 might be??? Regards Bryan Hanton
Electronics Forum | Fri Jul 20 08:16:48 EDT 2007 | hussman
Wow, I've never heard of this. If it voids during cure you either have a hot profile or bad adhesive. We use Loctite Chip Bonder. No problems.
Electronics Forum | Wed Jan 14 21:42:35 EST 2009 | davef
We view both Epibond 7275 and Loctite 3609 to be very similar. They're competing chip bonders.
Electronics Forum | Mon May 11 22:47:45 EDT 2009 | davef
We'd expect that a 0603 in properly cured, in-date code, properly dispensed chip bonder would take 5-8 pounds to push off the board.
Electronics Forum | Mon Jan 25 01:24:27 EST 2010 | sparrow
If the bumps are so small, I do not see any reason for considering Mydata, Siemens or any SMT p&p machine. Datacon's die bonders are very good ones. In your case, I would keep using them.
Electronics Forum | Mon Feb 15 21:24:11 EST 2010 | seabas
The CX-1 is a good choice. As accuarte as a die bonder, and as fast as an SMT placer. We love ours.
Electronics Forum | Tue Mar 16 20:45:51 EDT 2010 | r_nelson777
check out DIAS in HongKong. They may have what you need. website. http://www.diasautomation.com email. sales@diasautomation.com
Electronics Forum | Wed Apr 18 14:17:48 EDT 2018 | esoderberg
Further divide the ground block into more than 4 panes. Also think about using, assuming you have good placement of using Loctite chip bonder on two opposing corners. Lots of ways to get good results
Electronics Forum | Mon Apr 25 14:44:26 EDT 2022 | dwl
You could try putting a dot of adhesive like Loc tight chip bonder or similar between the pads. The adhesive will cure before the solder paste hits the reflow temp and hold the LED in place.
Electronics Forum | Mon Jul 31 18:41:07 EDT 2023 | emeto
Chip-bonder glue(Loctite 3612 for example) will harden at lower temperature way before paste goes to liquidus stage, so it will hold the part in place.
