Electronics Forum: bottom (Page 4 of 227)

Epoxy on bottom of SMT component

Electronics Forum | Wed Nov 28 06:56:57 EST 2007 | shy

the paste is necessary for the component that had no glue. btw, for solder paste specs, 150C is at reflow time plus soaking time and i believe it will cause nothing to the glue and can cured as per recommended? correct me if i'm wrong.

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 13:26:57 EST 2007 | realchunks

Nope, my thought process ejected from my brain and will have to watch this thread pan out from the side lines. Should be interesting.

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 13:35:04 EST 2007 | slthomas

It's OK, really. Stephen is carrying the torch for you now, although I don't know if dave is in or out at this juncture.

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 14:20:05 EST 2007 | realchunks

Shouldn't someone LIGHT the torch first? Good ol' Adolph starting a tradition that carries into today.

Epoxy on bottom of SMT component

Electronics Forum | Sat Dec 01 22:25:32 EST 2007 | molos21

Shy You should try SMT-5. First solder PTH comps, then apply paste with your pick and place and apply glue with ur screen printer and come back to place smd with pick and place and then reflow. You will get great results. Good luck

Epoxy on bottom of SMT component

Electronics Forum | Sun Dec 02 22:03:14 EST 2007 | shy

Hi Habsfan, if we're mount the THP first, we can't run SMT due to tTHP is tall and big which will causing the PNP to be chaos. Btw, my solder paste location is more than glue location which (solder paste : glue) is 2:1.

Epoxy on bottom of SMT component

Electronics Forum | Sun Dec 02 22:52:36 EST 2007 | shy

Hi Dback, Kindly provide your e-mail then i'll give the current opening pracitce at my area.

Epoxy on bottom of SMT component

Electronics Forum | Mon Dec 03 02:44:27 EST 2007 | shy

Hi Loco, If i cover all the SMT component with peel off before reflow, it'll increasing downtime at my production site. To reduce the downtime, we had idea to add in the glue for component package 0805 and bigger.

Epoxy on bottom of SMT component

Electronics Forum | Mon Dec 03 16:49:34 EST 2007 | stepheniii

Don't listen to Habsfan. He probably even thinks the Habs have won the Stanely cup. They've never won one. They've been given a few though.

Epoxy on bottom of SMT component

Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy

Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus


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