Electronics Forum | Wed Nov 28 06:56:57 EST 2007 | shy
the paste is necessary for the component that had no glue. btw, for solder paste specs, 150C is at reflow time plus soaking time and i believe it will cause nothing to the glue and can cured as per recommended? correct me if i'm wrong.
Electronics Forum | Sat Dec 01 22:25:32 EST 2007 | molos21
Shy You should try SMT-5. First solder PTH comps, then apply paste with your pick and place and apply glue with ur screen printer and come back to place smd with pick and place and then reflow. You will get great results. Good luck
Electronics Forum | Sun Dec 02 22:03:14 EST 2007 | shy
Hi Habsfan, if we're mount the THP first, we can't run SMT due to tTHP is tall and big which will causing the PNP to be chaos. Btw, my solder paste location is more than glue location which (solder paste : glue) is 2:1.
Electronics Forum | Mon Dec 03 02:44:27 EST 2007 | shy
Hi Loco, If i cover all the SMT component with peel off before reflow, it'll increasing downtime at my production site. To reduce the downtime, we had idea to add in the glue for component package 0805 and bigger.
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus