Electronics Forum | Thu Oct 08 11:33:16 EDT 2009 | cab
We are currently wirebonding MCMs with surface components located in very close proximity to wirebond pads, which are gold plated. We are ball bonding with 99.99% Au wire. Normally we do not have problems, however if product has been reflowed seve
Electronics Forum | Thu Jan 05 15:53:07 EST 2012 | davef
* Singulation (Wand 847-459-2400 F2421, Circuit Technology 708-705-2140 f2141 John Bambule, Pioneer - Dietecs 781-682-7900 F0338 Gerry Larson) * Routing (Cencorp 303-530-0891 bill stranathan 303-772-5933x227, 0Z0 Automation 800-366-0401 Chip Gill)
Electronics Forum | Fri Jun 13 16:23:47 EDT 2014 | esoderberg
I did not see any mention on the inner layer setback. We use 0.025" and have not had problems. Point loads with either a CAB or a FKN can sometimes be problematic. I would search out someone you know that has a fancort industries VDP5. This cuts th
Electronics Forum | Thu Jun 18 22:25:24 EDT 1998 | Dave F
| | | | | We're running into problems with board damage (broken traces, solder shorts) due to pliers and other bizarre tools being used for depanelization. I need some sort of fixture for this. A delrin plate with a slot cut to the correct depth and
Electronics Forum | Wed Apr 05 13:59:56 EDT 2000 | Kal C.
Hi Emmanuel, There is lots of info. in SMTNet archive (I think 98 Sept-Dec). I had a lot of problem with PBGA and certain uBGA with their PCB base material (FR-X) and encapsulant. Wolfgang is correct. We had to reprofile our reflow oven , qualify an
Electronics Forum | Thu Sep 16 09:29:13 EDT 1999 | Rob Jankowski
| | | Looking for a manual machine to de-panel with the panels held by 60mm tabs. Each panel hold multi-boards consisting of different shapes and sizes. Scoring is apparently not an option and volume does not dictate a large scale machine. | | | |
Electronics Forum | Thu Sep 16 09:31:05 EDT 1999 | Rob Jankowski
| | | | Looking for a manual machine to de-panel with the panels held by 60mm tabs. Each panel hold multi-boards consisting of different shapes and sizes. Scoring is apparently not an option and volume does not dictate a large scale machine. | | |
Electronics Forum | Wed May 10 12:13:16 EDT 2006 | scombs
We have a 6 up panel with a 1206 part .082" from the board scoreline. After depanelization when we run the board through ICT it fails for a short at that location. We have visually inspected at high magnification for any cracks in the body and at the
Electronics Forum | Wed Aug 08 17:50:22 EDT 2007 | flipit
X7R >Z5U,Y5V Greater means less likely to crack or in other words NP0 is better than X7R for crack resistance. Don't think that there is a set formula. There isn't! I cracked ceramic resonators at 0.050" from the board edge with CAB M2 and M3 dep
Electronics Forum | Thu Aug 16 13:00:32 EDT 2007 | russ
Here is what you need to do if you can, Since you want to shporten the bake time you need to increase temp. weigh a board prior to your current bake process (you need very hi resolution scale for this) weigh the same board after current process a
