Electronics Forum | Fri Jun 15 13:46:03 EDT 2001 | Scott D
Igmar, I would check a couple of things. First, check to make sure your oven profile is acceptable. You do not want to shock the parts. Second I would check to see if the parts are breaking in a consistant pattern. Are they always split at the
Electronics Forum | Tue Nov 20 19:08:15 EST 2007 | Peter
Hello, I would like to ask for opinion on an epoxy application. We apply RTV to bond and secure 2 electronic devices on a PCB. But after noticing the RTV bond breaking off during vibration test, our customer has specs in a 5min 2-part epoxy (made
Electronics Forum | Mon May 10 15:26:11 EDT 2004 | hertenstein
Sorry, I was not clear. I am interested in the strain on the PCB during depanelization using a parallel blade shear. And the effect on ceramic capacitors on the PCB. I was not shearing the capacitor off of the PCB. Regards, Jeff
Electronics Forum | Fri Feb 10 13:02:00 EST 2023 | stephendo
Those capacitors look totally fluxed. I can't tell if the last photo is showing a concavity or a blob of stuff. I think it is a blob of flux and contaminants. Does it burn off with a soldering iron?
Electronics Forum | Thu May 11 17:28:40 EDT 2006 | bradlanger
Steve, We have had the same problem at my company and unfortunately I do not have any good news for you. We are using a pizza slicer type depanalizer from FKN and if the MLCC caps are layed out too close to the edge they still break. We had to add th
Electronics Forum | Fri Nov 19 13:47:03 EST 2010 | cyber_wolf
We have witnessed capacitors falling off in wave due to mold release being present on the component.
Electronics Forum | Wed Jul 10 04:53:47 EDT 2002 | redmary
a leakage exists in the capacitor net (1206), which cause the voltage down so much. the process flow is: printing-placement-reflow-hand load-wave-depanel-FT. I find possible stress maybe exists in the depanel stage, does the extra stress cause the ca
Electronics Forum | Mon Nov 08 11:01:12 EST 1999 | Brian Larson
We are leaving 12-18 thousands material when scoring. Several components are cracking during depanelization. The pizza cutter machines out there are either too expensive or too slow to solve our problem. I am looking for a magical solution. In case
Electronics Forum | Thu Feb 04 21:17:41 EST 1999 | Chris G.
| What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ? | IPC states: 50% off pad for class 1 and 2 25% off
Electronics Forum | Mon Jan 24 06:19:04 EST 2011 | fönsi
Hello! I've had the same problem about one Jear ago. We had exessive building of voids in the solder joints. I recomment to take a pincer to break off some of the components. If the solder joint is good, the copper pad will stay at the solder joint
