Electronics Forum | Thu Nov 29 03:19:46 EST 2018 | robl
You may want to look at a product called place & bond underfilm. It is essentially a SMD tape and reel placed pad that acts like underfill when going through reflow. I got some samples from an APP tech day and had a play and it bonds very well. Y
Electronics Forum | Mon Dec 14 13:20:56 EST 2009 | stepheniii
Xrays go through aluminum quite well. I've xrayed BGAs with heat sinks that were well over an inch tall and they only made faint shadows. What material is the bottom of the PCB? And how are you going to bond to it?
Electronics Forum | Wed Jul 31 13:19:38 EDT 2013 | anvil1021
Does anyone know how to test for hard gold on a PCB? We are in a challenging situation with a PCB provider and we need some objective evidence other than wire bond failure to present to them. Any comments could help ....Thank you Anvil
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure
Electronics Forum | Mon Jun 03 12:51:17 EDT 2002 | V.RAMANAND KINI
We are doing COB operations for nearly ten years. Pls. write to me if you need info on m/c selection, type of PCB, plating etc., Thanks V.RAMANAND KINI...03.06.02
Electronics Forum | Tue Jul 31 06:33:58 EDT 2001 | nifhail
What is the industry standard specification for Resisitivity monitoring at aqueous cleaning? What would be the diff. between specs. for normal PCBA vs PCB that has to go through wire bonding after SMT for COB process. pls advise..thx
Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary
we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks
Electronics Forum | Fri Sep 27 10:05:07 EDT 2002 | oconnorp
I spec COB using wire bond attach - 0.75um � 0.25 Gold over 5um � 3 Nickle.
Electronics Forum | Mon Aug 27 08:03:32 EDT 2007 | davef
Actually, you will be soldering and wire bonding to the palladium layer, so we should have asked if you checked that layer, rather than the nickel. We not sure of the source of the copper that your see on EDX. It's possible copper from the pad migra
Electronics Forum | Wed Mar 11 10:55:07 EDT 2009 | gpost
I had contacted the dummy component suppliers but they didn't have anything that would work. We designed a simple daisy-chain PCB and die for SPC and training purposes, and purchased large quantities.
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