Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Wed May 09 12:07:52 EDT 2001 | caldon
My personal favorite is the Siemens F series and the UIC GSM platform. Both Siemens and UIC have awesome resources for csp, flipchip and baredie processing - Siemens= Dan Baldwin from GaTech; UIC = George Westby from UIC labs. My second choice would
Electronics Forum | Thu May 10 02:57:03 EDT 2001 | kjellman
Hi, Why not have a look at Philips/Assembl�on, their ACM machine is quite nice. It may also bring you down to Flip Chip, 0201 some through hole and odd form placement. Nice options like bulk feeding, coplanarity tests, fluxing for FC, prom feeders (
Electronics Forum | Fri Dec 13 11:29:30 EST 2002 | R.G. Albada Jelgersma
I am looking for a facility to fulfil my needs in tape and reeling (re-reeling and from tubes to reel), anti-static and humidity packing etc. in the EU, preferably Holland / The Netherlands / Belgium. In my search I am a bit stuck. Could you help me
Electronics Forum | Thu Jun 01 07:40:23 EDT 2006 | netellink
I have a Suzuki vision machine with 4 heads (SMT-1000VL). This machine is using the camera to inspect the nozzels (4 sets) in the nozzel tray changer every time it is going to change the nozzel(s) in the 4 heads. The problem I have is now the machine
Electronics Forum | Thu Jul 20 16:08:18 EDT 2000 | Grant Baynham
Do you have any experience with flip chip applications using lead-free solder, and specifically do you have any information revealing how the process parameters for standard air reflow atmosphere can be modified to match the results for solder reflow
Electronics Forum | Thu Jul 11 17:26:27 EDT 2002 | Tony B
Does anyone know how the Fuji IP2 can be adapted to place BGA's? The MTU places the chip on a carrier with suction in the center and it will not hold on to the BGA due to the lack of a flat surface on the bottom. I have had limited success building
Electronics Forum | Sat Aug 02 08:06:11 EDT 2008 | pcbbuilders
Is there a limit to the time that most components can stay at temperatures around 130-200 deg c? if i slow the time, the first 4 zones will be at this temp for about 5 minutes in no lead process. i am concerned that some chips wont be rated at this t
Electronics Forum | Wed Aug 12 03:43:01 EDT 1998 | Terry Keen
We are taking enquiries for sub-contract work that we hope to be doing by Christmas. One of the enquiries is to assemble chip capacitors and an SO14 onto ceramic. Does the printing process, paste used and reflow process remain the same, or are there
Electronics Forum | Fri May 07 02:27:57 EDT 2004 | Grant Petty
Hi, They do what we need component wise, however I was wondering if anyone had info on reliability, ease of programming. We are looking XP 142 and 242 series chip shooters and fine pitch placers. Regards, Grant Blackmagic Design
