Electronics Forum | Thu Nov 29 22:38:05 EST 2007 | shy
Hi Dback, Yes, i'm open "dog bone" aperture for my chip component. this is to prevent solder ball issue. For fine pitch i'm opening square with full length and half width to prevent bridging. Btw, if "dog bone" is not for chip component, what is your
Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI
Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject
Electronics Forum | Tue May 23 09:01:21 EDT 2000 | Wirat S.
Dear all friend, I found problem of soldering bridging between SMT Chip terminal & Glue , but under the chip body. My process was double side SMT assembly with bottom side adhesive & heat curing, then wave soldering with water soluble flux (OS type)
Electronics Forum | Mon Jan 17 02:40:17 EST 2000 | park kyung sam
Hi. smtman would someone answer me ? it's just the stuff pop ups without deep thinking. how much do our department spend money for 1 chip soldering. what should i consider ? i wonder i spend more money than other guys out there for 1 chip soldering i
Electronics Forum | Wed Feb 05 20:56:23 EST 2003 | jonfox
I think you just answered a questioned that I never thought to ask. Are bulk parts manufactured differently than standard tape and reel parts? That would explain why there is a bigger price difference in parts from Murata and not from others. As I
Electronics Forum | Wed Jan 17 20:08:23 EST 2001 | John Dwinell
Hello All, I am looking for any insight RE: reworking the Xilinx 4044XL 40x40 BGA chip. A customer of mine has no trouble removing it, however, when installing with their BGA rework station, the corner solderballs consistently collapse. Has anyone
Electronics Forum | Wed Jan 19 02:00:36 EST 2000 | erico
Hi wolfgang, I think Pc is not talking about the tombstone cause this terminal lifted is different from tombstone. The terminal of chip is still there but can not be solder anymore so we have to replace the chip. I also facing this problem. So can yo
Electronics Forum | Sat Jan 15 03:30:25 EST 2000 | Dean
I have reduced solder balling by up to 60 percent by changing the placement height on chip parts. Essentially account for the 6 mills of "Z" height to reduce the "squeezing" effects of the chip impacting the solder bricks. Cheap and easy, especial
Electronics Forum | Tue Dec 21 00:10:00 EST 1999 | Edmund
Currently i am producing a board using dloble reflow process. The bottom side is mostly 0603 chips and some SOIC. The top side is mostly QFP and some heavy component. During the double reflow process , the capacitor chip on the bottom side drop(same
Electronics Forum | Sun Sep 12 03:50:13 EDT 1999 | Bach Huss
Hi All, Does any one out there have SPC control on Chip placement Machines? I was wondering what type of parameters we can monitor. We have Siplace here equip with SEC-GEM and a monitoring software. Just curious if anyone has done SPC on Chip placem
