Electronics Forum | Fri Jun 18 10:46:10 EDT 1999 | Scott Cook
| | | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads
Electronics Forum | Fri Jun 18 11:37:10 EDT 1999 | Earl Moon
| | | | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pa
Electronics Forum | Fri May 22 13:14:42 EDT 1998 | Earl Moon
| | | | Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has rece
Electronics Forum | Mon Jan 25 13:42:35 EST 2010 | patrickbruneel
This is a post from another forum as a response from Bob Landman to a claim that he had no evidence to be concerned about lead-free in hirel applications (interesting read). See below and am sure many technetters will find this interesting **********
