Electronics Forum | Tue Jul 10 07:22:48 EDT 2007 | davef
Q1. Is kapton tape an industry accepted way of protecting gold pads from solder splashes? A1. No. It is more accepted to resolve the reason behind the solder splats, so that the added labor and cost of taping is eliminated. Search the fine SMTnet Arc
Electronics Forum | Wed Sep 18 22:10:48 EDT 2002 | Joe Wong
I'm working China ,in my working factory is a electronic OEM factory and got COB and SMT. But recently, COB got a big problem because the PCB gold finger got a contamination, that make us got a most defect product. So anyone can answer me how to clea
Electronics Forum | Thu Dec 14 18:46:50 EST 2000 | Danny Carr
Check some of the links on EverythingPCB's Technical & How to pages: http://www.everythingpcb.com/p2404.htm
Electronics Forum | Thu Dec 14 19:54:23 EST 2000 | Dave F
SMT Magazine has "SMT In 10 Easy Steps or "Back To Basics" or something like that on their site that is a good starting point. If you want the one line definitions SMTnet has a "Terms & Definitions" in the "Library" You could ask us.
Electronics Forum | Wed Nov 08 14:28:39 EST 2000 | Finepitch Services
the current design must be a die-up one, so routing for a flip-chip on board will be a bit difficult. it almost HAS to be wire bonded, to me...
Electronics Forum | Fri Sep 15 19:50:54 EDT 2000 | Murad Kurwa
Try IPC-SM-784 Guidelines for Chip-On-Board Technology Implementation (pg 16-17). Contact IPC or Document Center http://www.document-center.com/home for a copy. Goodluck Murad
Electronics Forum | Sun Jan 28 15:34:01 EST 2001 | Kelvin
Dear David, I suppose you may contact Cookson Performance Solution. They offer quite a wide range of service. http://www.cooksonsolutions.com I hope you find it useful. Kelvin
Electronics Forum | Tue Jul 31 06:33:58 EDT 2001 | nifhail
What is the industry standard specification for Resisitivity monitoring at aqueous cleaning? What would be the diff. between specs. for normal PCBA vs PCB that has to go through wire bonding after SMT for COB process. pls advise..thx
Electronics Forum | Tue Nov 24 13:55:17 EST 1998 | trien pham
I have a COB device that I need to decapsulate for failure analysis. I would like to find out how I can do it using common materials/process that I can easily find. Thank you and I look forward to hearing from you soon.
Electronics Forum | Wed Sep 26 12:31:02 EDT 2001 | nifhail
Let's assume that SMT or MEMS or COB etc, is a new things and about to be introduced to the line, nobody knows about this new process and I was asked to select the critical proceses and parameter, how and where should I start? Thanks and best rega
