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Heller 860 Pressure Curing Oven PCO

Heller 860 Pressure Curing Oven PCO

New Equipment | Reflow

Heller 860 Pressure Curing Oven PCO Reflow Oven SMT Reflow Oven Heller 860 Pressure Curing Oven PCO Pressure Curing Oven PCO Product description: Heller 860 Pressure Curing Oven PCO  INQUIRY Heller 860 Pressure Curing Oven PCO Machine

qismt electronic co.,ltd

Tresky’s Product Technologies Provide High-Quality Solutions for Microelectronics

Industry News | 2013-06-20 19:31:51.0

Tresky, announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.

Tresky AG

NEO Tech Partners with QT Ultrasound® to Deliver Supply Chain Scalability for Its Innovative Ultrasound Technology Platform

Industry News | 2019-01-08 20:18:30.0

NEO Tech announces that it has entered into a new engineering and manufacturing partnership with QT Ultrasound, a company engaged in the commercialization of an innovative automated breast imaging system producing high-resolution quantitative transmission ultrasound images.

NEO Technology Solutions (NEO Tech)

Indium Corporation to Showcase High-Reliability Materials for Power Electronics at APEC

Industry News | 2024-02-19 12:00:05.0

Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2024, February 25‒29 in Long Beach, California.

Indium Corporation

What's the Difference between Semi-Hermetic Compressors and Hermetic Compressors?

Industry News | 2021-12-24 20:11:55.0

In the hermetic compressor, the motor and the compressor share the main shaft (reciprocating type), and the compressor unit is suspended in the housing by spring. The casing is divided into upper and lower parts. After the internal components are assembled, the upper and lower interfaces will be sealed by welding. The suction pipe, exhaust pipe, and process pipe are drawn out of the outer shell.

OKmarts Industrial Parts Mall

Re: Printed Circuit Board Material

Electronics Forum | Wed Oct 18 16:41:35 EDT 2000 | Dave F

It's unrealistic to think that two materials with the following disperant properties would have the same reflow profile. From http://www.norplex.com/Carrier.htm Physical Properties / NEMA FR-4 / NEMA CEM-1 Glass transition temperature �C / 130 / 10

X7R woes

Electronics Forum | Tue Jan 03 05:08:50 EST 2006 | Rob

Yes - as they flex less due to their size. I do have the calculations somewhere from my field apps days but it may take some time to find. The problems occuring with the X7R's MU

Torque Setting

Electronics Forum | Mon Aug 02 09:26:15 EDT 2004 | davef

Q1: How do you define torque setting for screw? A1: Talk to people at your nut supplier. Some nut suppliers post torque tables on the web. For instance: http://www.thelenchannel.com/1torque.html http://www.marfas.com/Ttorque.shtml http://www.pac

Cracked Capacitors

Electronics Forum | Fri Sep 09 07:55:08 EDT 2005 | davef

This pattern indicates flex cracking due to excessive bending of the board or fixture after soldering. Ceramic is strong in compression, but weak in tension. When bending causes damaged parts, look at: * Board flexes, ceramic is strong in compressio

Gold Immersion - Soft Joints

Electronics Forum | Mon Oct 25 14:48:29 EDT 1999 | William

All, I am having a problem with joints being soft after SMT. Especially 25 mil and smaller parts. It seems as though you can slide the leads right off of the solder. It takes only about 30-40 oz. of compression at 45 deg. to move leads off of join


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