Electronics Forum | Thu Mar 11 11:58:18 EST 1999 | P.L. Sorenson - Technical Consultant
| Looking for advice/products on ways to get heat out of a package and into an internal thermal plane. Will have electrically isolated thermal pads (going to an internal thermal plane) under the part. | | Need a way to get good thermal contact betwe
Electronics Forum | Tue Oct 30 22:08:45 EST 2001 | flynhi34
I have not looked into eutectic die attach. My dies are about .012" square and could get smaller. Currently using a Epoxytech conductive adhesive. I am going to go out and look at equipment and build samples. Some vendores state they can do .010"
Electronics Forum | Mon Dec 07 09:22:50 EST 1998 | rick
| Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | Any in
Electronics Forum | Tue Feb 11 13:12:25 EST 2003 | Jim Mills
Use a PCB fab house that is capable of "Conductive Via Filling" is the way to do it right. A conductive epoxy is used to fill the drilled via PRIOR to final plating. After final plating, the surface of the "Filled Via" will appear to be the same as t
Electronics Forum | Fri Dec 04 19:17:03 EST 1998 | Jason
Jeff, I used conductive epoxy for diebonding and chipcaps on hybrid xtal controlled osc. We were applying via stencil printer, then curing in a KME vertical cure, a real foot print saver. Even under controlled environmental conditions, it was a re
Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David
Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?
Electronics Forum | Fri Aug 03 19:03:32 EDT 2001 | seand
Hello John, What is the key reason requiring that this unknown material be injected from below vs. dispensed prior to placement. Is it an issue with reflow temperatures, effect on placement/thermal expansion? Is this a true requirement or specul
Electronics Forum | Fri Aug 03 22:36:28 EDT 2001 | mugen
We used Thermal Pads, made of black rubbery material, and sticky on both sides (like x2 side tape), intent is to place in between, BGA/QFP and the PCB board, and reduce the air-gap flow between, the PCB to SMD... air-gap will permit air flow, that i
Electronics Forum | Tue May 23 09:50:37 EDT 2006 | flipit
They work well in silver conductive epoxy in hybrid applications. They are very poor in no clean applications. They don't work that well in OA solder paste either. Used them once in OA paste and in a nitrogen. They looked just fine. Solder to Pd
Electronics Forum | Tue Jan 19 19:41:09 EST 2021 | rgduval
Double check your p/n and your datasheet, and with your supplier. I had this happen one time, though it wasn't with flexi-term parts. Mine ended up being palladium plated end-caps (my buyer and receivers had all missed the applicable suffix issue o
