Electronics Forum | Wed Jun 11 15:57:39 EDT 2003 | pjc
Frank, ECD (WaveRIDER) and Datapaq (Optimiser) have wave solder machine process control devices. They will check the following: 1. Conveyor speed 2. Preheat Temps 3. Solder Temps 4. Wave Dwell/Contact Times 5. Wave Heights 6. Waves Parallelism Go
Electronics Forum | Thu Sep 23 22:31:25 EDT 1999 | Dave F
| | i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the scree
Electronics Forum | Tue May 08 09:50:19 EDT 2007 | patrickbruneel
Hi Loco, Good point!! The good old glass plate works just fine as long as the conveyor or carriers have L shaped fingers. A glass plate is usually about a � inch thick (a lot thicker than the actual board). With L shaped fingers the bottom of the gl
Electronics Forum | Thu Feb 19 15:17:52 EST 1998 | Bipin Napal
Available immediately. Call Bipin at 416-385-0855 Make: Electrovert Model: 500 CLV Electrical: 440V, 3Phase, 60HZ Manufacturing Date: Dec 22, 1992, and upgraded in 1994 Physical Size: Length 205.5�, Width 55� Heating Zones : 10 Upper & 10 Lo
Electronics Forum | Tue Feb 19 15:59:55 EST 2002 | pjc
Surface tension is a likely cause. Surface tension is a negative wetting force. You may have a solderability problem. Be sure your flux is properly activated according to the flux mfg. top side board temp. specification. When surfaces to be soldered,
Electronics Forum | Thu Sep 20 03:31:42 EDT 2018 | minhhaioh34
Hi all, I need some pro help me with issue bubbles after coating. some information for some pro: Machine: Asymtek Chemical: Achime AVR80 Oven: IA 4 zoon4 ( setting 100 100 90 80 conveyor speed: 0.6 m/min). I had happened before and after the oven. W
Electronics Forum | Tue Aug 21 08:44:48 EDT 2001 | caldon
A) The standoff height of some uBGA components does not allow water to penatrate under the component. B)Water soluable may dilute the flux and not remove it all together. This can be tested with Ion Chromatography. C) Water soluable in some cases ne
Electronics Forum | Mon Aug 27 09:56:00 EDT 2001 | stefan
I wonder what kind of equipment the board designer had in mind? Are you shure you can do the board with a Mydata ? Where do you put the tray for your 20 mil QFP's? 10 mm thick plus component height also appears to be a problem. Multitroniks can do la
Electronics Forum | Tue May 26 06:56:40 EDT 2009 | xinxi
Hi! From your post, it seem like the wave did not really touch the component. You probably need to get the both wave height correct and that it hits the component.It is normal for solder to come through the PCB when using chip wave. The through-hole
Electronics Forum | Mon May 22 17:54:46 EDT 2017 | zsoden
Thanks for the replies. The single missed lead is a bit odd - we usually have an entire area missed and that's due to the board not sitting properly in the pallet fingers. I figured in this case it was likely due to poor fluxing? We have always str
