Electronics Forum | Tue Sep 09 15:10:01 EDT 2003 | swagner
Has anyone had negative experiences with hasl thicknesses below .00005'' of an inch on copper? If so could you please respond with what the problems were. Thanks in advance!!!
Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon
| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | I
Electronics Forum | Tue Jul 30 08:38:55 EDT 2002 | dasal
Truthfully, there are pro's and con's for both technologies. (put cost of ownership aside for one moment) Nitrogen won't dry humidified components as rapidly as a desiccant dry box. I'm talking about a self regenerating dry box that uses molecular s
Electronics Forum | Tue Aug 22 10:06:53 EDT 2000 | George English
Has there been a definite date for the total move over to lead free? Will it be 2004 or 2008. Also is there a direct replacement for leaded solder, I have read various articles on numerous alloys suggested for the switch, such as bismuth, tin, copper
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Electronics Forum | Fri Mar 11 18:30:50 EST 2005 | davef
Russ: In December 2003, the European Commission released the following statement: �The commission services have prepared a draft Commission decision establishing maximum concentration values pursuant to Article5(1)(a) of Directive 2002/95/EC. The pr
Electronics Forum | Wed Jan 03 21:20:22 EST 2007 | davef
Comments are: * General purpose RTV (RTV-108) releases an acetic acid (vinegar) during cure and corrodes copper, brass and sensitive metals. It is therefore NOT for use in delicate electrical or electronic applications. However, there is an electrica
Electronics Forum | Mon Aug 30 14:46:56 EDT 2010 | davef
Sure, you should be able to measure the copper oxide thickness on the inner layers of a PCB when doing sections.
Electronics Forum | Mon Nov 20 04:04:42 EST 2000 | Gyver
Sirs, Please do me a favor to answer the following questions, thanks a million! 1. Will the baking of BGA or PCB cause more oxidation before the SMT process? 2. What is the acceptable Life Time of solderability at customer site? The time that the sol
Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD
Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from
