Electronics Forum: core and flatness (Page 4 of 9)

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind

Comparison between Vitech and Mirtec

Electronics Forum | Mon Jan 10 18:35:05 EST 2011 | eadthem

Ive used a Mirtec machine for 3 years MV3L with side angle inspection. Mirtec has some issues documentation, and repair plus. But there machine is impressive and the AOI software is good. We can find about 90-99.99% of all errors using just the 5

kapton dots and liquid solder mask

Electronics Forum | Wed Aug 10 11:57:16 EDT 2005 | pr

Is the peelable mask (put on by the boardhouse) flat on the surface of the pcb? If so can you tell me the material name, so maybe I can find a picture? We have to print adhesive on the board, so the mask has to be flat. That is why Kapton from the b

Pick and Place Camera sees Red

Electronics Forum | Fri Sep 16 09:39:15 EDT 2005 | electromek

We had some defective camera's on our GSM's. The repair guys wanted $12,500US for two replacements from UIC. I found rebuilds at this place in New York State for $249 each. They have been working great for two years now. I even got back $30 for the o

PWB packaging for shipment and storage

Electronics Forum | Wed Oct 20 10:41:22 EDT 1999 | Eric Lerz

Our company (assembler and user) has experienced some board problems relating to warpage and solderability. The manner in which they are packaged by our fabricators and stored in our stock prior to assembly has been questioned (as one of many factor

optimun height between lead and pad?

Electronics Forum | Tue Dec 04 09:48:43 EST 2001 | davef

Defining the thickness of solder between the lead and the pad, J-001 states "Properly wetted fillet shall be evident." J-001 is available from http://www.ipc.org. Factors that affect this are: * Amount and composition of solder * Amount and compo

Any different between Flat Ribbon and Gull Wing Component?

Electronics Forum | Thu Apr 12 15:53:59 EDT 2007 | realchunks

Steve is right. There is a difference between flat ribbon "devices" and flat ribbon "cable". IPC standards are the same for flat ribbon as gull wing. Here's a pic for example: http://www.topline.tv/FLATPACK.html

warped boards and cracked solder joints

Electronics Forum | Mon Oct 29 18:21:43 EST 2001 | slthomas

We recently have received a lot of warped (bowed and/or twisted behond IPC 600 specs.) bare boards (some our fabricator's fault, some ours by design) and I can't help but figure that long term reliability will suffer when building product with them.

Re: Bow and Twist of PCB's

Electronics Forum | Wed Aug 19 08:00:55 EDT 1998 | Earl Moon

| Hi there, | I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In orde

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 19:32:02 EST 2000 | Michael Parker

Prof. Whoopee - amazing facts that you find on your 3-D BB, it has completely confounded my comrade, Chumley. Plainly spoken that around the SF Bay Area a.k.a. Silicon Valley(ever hear of the famous SF Fog?)during the winter months, near the coast a


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