Electronics Forum | Tue Jun 22 08:37:52 EDT 2010 | davef
Dennis: These "terminal detach failures" probably are caused by thermal shocking of the components. * Preheat the components * Use a hot air pencil rather than a soldering iron
Electronics Forum | Fri Jun 25 05:34:40 EDT 2010 | ppcbs
Hi iv40 Try with NIC ceramic capacitor that was tested in wet process. We hav succeed with these cap after we found some failure with Kemet ceramic Cap which tested in dry test process while manufacturing.
Electronics Forum | Fri Jun 25 08:38:37 EDT 2010 | mun4o
Thanks, Dennis. That is a good idea, but I have problem :) - our logistic department lookig for cheap components...What other mnfg of cap you use? Regards,
Electronics Forum | Fri May 31 23:48:14 EDT 2019 | dhanish
Thanks Dave..My customer proposing to reduce the solder volume.Can the TCT be improved by reducing the stand-off height?
Electronics Forum | Sat Jun 01 07:22:40 EDT 2019 | edhare
Just the opposite, reducing the standoff increases the shear strain range in temperature cycling, which lowers the number of cycles to failure.
Electronics Forum | Mon Jun 03 13:01:59 EDT 2019 | slthomas
Is there any chance that the boards were mechanically stressed (for instance, installed in a fixture) before, during, or after the testing? I'm just looking for other possible root causes.
Electronics Forum | Thu Sep 09 04:51:19 EDT 2004 | Simon UK
65%), if one failed on the board i replaced all of them, and re-tested and thermally cycled them inline with our spec (-55/+80 Deg/C for 48hrs) this was a nightmare, especially when some cracks were not detected until several weeks later while flying
Electronics Forum | Fri Jul 09 19:09:52 EDT 2010 | rway
A couple of things: Does the cap break if you try to remove it with hot air? If not, than you are breaking the caps do to mechanical stress. We have had similar issues. I don't think your board is suffering from mechanical stress from depaneling o
Electronics Forum | Fri Feb 22 08:26:51 EST 2002 | davef
You are correct. The gold dissolves in the solder. The gold is meant to protect the nickel from oxidizing, so that you can solder to the nickel. Obviously that didn�t work as planned. Your background information is very sparse. Two things come
Electronics Forum | Tue Feb 26 10:55:58 EST 2002 | davef
This could be an electroless nickel / immersion gold specification. While the symmetry of the numbers is pleasing to the eye, but as Joyce Marchand says, "It doesn't blow-up my skirts." Problems with your specification are: * Lower end of the gold
