Electronics Forum | Fri Aug 14 08:59:51 EDT 1998 | Dave F
| | | Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | | | Xingsheng | | Xingsheng: Welcome. | | Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill | | Web resources: htt
Electronics Forum | Thu Feb 17 22:08:19 EST 2000 | Dave F
Scott: I'll miss you, but there's no sense lettin' the blanks get you down. This is 'sposed to be fun!!! Good luck guy. Dave F
Electronics Forum | Thu Feb 17 22:08:19 EST 2000 | Dave F
Scott: I'll miss you, but there's no sense lettin' the blanks get you down. This is 'sposed to be fun!!! Good luck guy. Dave F
Electronics Forum | Tue Nov 30 17:07:42 EST 1999 | Dave F
Wendy: The IPC-SM-782 Pad Calculator (www.ipc.org/html/fsresources.htm) should be able help you solve your problem. Good luck Dave F
Electronics Forum | Wed Dec 06 20:19:24 EST 2000 | Michael Parker
Ralph- Good thing you found this website so early on in your CM worklife. I am guessing you knew the job was dangerous when you took it. Be sure to refer back here daily, you will learn a mountain of things in a short time. The library also has a va
Electronics Forum | Wed May 03 20:10:57 EDT 2000 | Dave F
Erhard: Several companies make feeders that move leadless chip components from a bulk feeder carrier, line them up head-to-tail, and present them to the pickup head of a high speed placement machine. Try: * Panasert * Suzuki � but you probably a
Electronics Forum | Mon Feb 07 13:20:03 EST 2000 | Dave F
Graham STOP!!! You can not be totally serious. A five year old cost model counts bean, and beans are beans. I have to know more about the calculation. If this bores some of your gear-heads, click on "return." � Help me with the terms: - "Ops cos
Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
