Electronics Forum | Thu Feb 28 18:42:35 EST 2002 | Nightbull
Thank you for your reply. Answer: Auditor came to my company and said that we needed a solder deposition tester. The reason was that we had no real way of assuring that our solder process was repeatable. He referred to several IPC standards that mad
Electronics Forum | Wed Apr 30 12:30:14 EDT 2003 | Guillermo
Hello, I would like to ask for cooments/advices about the inspection of small solder deposits inspection (aprox 4 mills). We tried with X ray and Scanning acoustic microscope but it looks like due to the small size, we could not be sure to get all t
Electronics Forum | Fri Nov 07 15:57:56 EST 2003 | Marc Simmel
Are there specifications or recommendations for electro-deposited tin-lead plating thickness on austenitic stainless steel that would provide a shelf life of 1 year? 6 months? Would 2 to 3 microns (78 to 118 micro-inches) 90/10 tin-lead over 1.27 mi
Electronics Forum | Tue Nov 30 11:09:16 EST 2004 | fcox
Mesh opening size may be a factor in whether or not the paste will pass but only in very fine line deposition. Generally speaking, the printed line width and deposition thickness determine what mesh to use. The paste supplier will be able to tell you
Electronics Forum | Fri Mar 09 05:06:09 EST 2012 | grahamcooper22
Is your solder paste deposit drying out? Or if the paste deposit is small or there is insufficient paste then the tack between the device and paste will be poor so it can easily come out of the paste during its placement or placement of other parts.
Electronics Forum | Mon Oct 02 14:46:06 EDT 2023 | davef
Lab tests can confirm the composition of your material. I'm going with tin oxide. Tin oxide changes color depending on the thickness of the deposit. Your deposit is fairly thin. It will change to a brown color as the thickness increases. Your EDX
Electronics Forum | Wed Nov 03 21:17:40 EST 1999 | Doug B.
Yes this is absolutely true. No-clean flux residue has various affects on the functionality of circuitry especially high impedance circuits. It also affects solderability, and reliability. No-clean flux will always leave a detectable residue. Mos
Electronics Forum | Tue Sep 21 13:17:29 EDT 1999 | Dave F
snip | I've often been tempted to try something a little different when specifying QFP apertures. Like, for example, using long, tapered triangular apertures arranged in alternating directions. The objective being, get the maximum amount of paste do
Electronics Forum | Thu Jul 23 13:11:13 EDT 1998 | Gestapo Allen
I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the rew
Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette
| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r
