Electronics Forum | Wed Sep 01 10:15:44 EDT 2010 | arjan
Dear Sachu_70, During the tests we also checkt other devices, there are a few small voids visible, but they are marginal. We only see large voids in this device. During the testruns we tried several reflow profiles, but without large succes.
Electronics Forum | Thu May 13 16:59:08 EDT 1999 | KT
Looking for a reasonably priced portable device to do strength test(shear/twist)on glue cured Cap/Res. Any suggestions? Thanks
Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef
Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input
Electronics Forum | Fri Dec 31 20:04:10 EST 1999 | Stu Leech
At Altos Engineering we do a lot of process testing of our TVP drying systems for demoisturizing. We store test devices in metalized vapor-proof bags. Instead of heat sealing, we use Croc-Clamps to seal the bags. They have been tested for sealing eff
Electronics Forum | Mon Jan 12 12:16:18 EST 1998 | Alan Bryan
Does anyone have any information on reballing BGA devices? I'm looking for specs, a process flow, and what tests should be performed afterward. Also, I'm looking for any companies that contract this service. Thanks.
Electronics Forum | Sat Dec 29 01:28:48 EST 2018 | emmamillathompson
We are using a smps for our comm pcb , a relay and a current sensor, which uses 4.2v, 12v and 5v respectively. We are controling one phase of a three phase 5hp water motor. Also smps circuit and relay output are in parallel so output load doesnt effe
Electronics Forum | Mon Oct 13 11:01:25 EDT 2003 | markhoch
Our customer is starting to see some solder joint failures during their extensive testing proceedures. Specifically with an SMD/DIP device that has a very small foot in relationship with the pad on the PCB. (By SMD/DIP device I mean a DIP IC that has
Electronics Forum | Sat Apr 16 13:43:53 EDT 2005 | KEN
What about electo migration? I had (what apears to be) the exact same problem you describe. X-ray and ICT fails to detect micro shorts. However, in our test, the bench functional test would show a current overload. In some cases the electro migrti
Electronics Forum | Thu Feb 24 20:47:27 EST 2000 | Todd Woods
The camera is important. I found the only machine, granted this was a year ago, capable enough for volume production, was the KME CM-88. Our test had 1 mispicked device of 5,000,000 attemps and 0 misplacements.
Electronics Forum | Wed Jul 03 10:37:41 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
