Electronics Forum | Thu Aug 26 10:49:36 EDT 1999 | Wolfgang Busko
| | | Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | | | Going through datasheets wasn�t that helpfull, so does anyone know of a source
Electronics Forum | Thu Aug 26 10:21:22 EDT 1999 | John Thorup
| | Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | | Going through datasheets wasn�t that helpfull, so does anyone know of a source for
Electronics Forum | Wed Jun 02 07:28:03 EDT 1999 | Earl Moon
| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa
Electronics Forum | Wed Jun 02 11:29:39 EDT 1999 | John O'Brien
| | I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera ca
Electronics Forum | Thu Jun 03 15:15:09 EDT 1999 | J.S.
| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa
Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002
This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre
Electronics Forum | Fri Nov 12 10:40:17 EST 1999 | Dave F
Some under-the-hood automotive people have moved from no-clean to clean, and I mean CLEAN, recently. Hmmmm Dave F
Electronics Forum | Mon Sep 14 11:02:28 EDT 1998 | Steve Schrader
| Can anyone point me in the right direction for information on this subject, my understanding is that it is a new technique, not in widespread use yet. click on the link to ITM-SMT.com
Electronics Forum | Tue Oct 22 20:37:09 EDT 2002 | davef
Pd takes longer to desolve than the materials yer used to using. Search the fine SMTnet Archives for background on modifying your reflow recipe.
Electronics Forum | Tue Jan 15 10:53:18 EST 2013 | boriskilk
We wouldn't advocate extending the soldermask beyond the component body but yes to ganging for fine pitch. To ensure we don't run into issues with flaking our preference is not to add solder mask when the space between pins is less than 6 mil.
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