Electronics Forum | Wed Sep 20 10:00:40 EDT 2000 | Erick Russell
Yes, some testing of soldering chip capacitors onto ceramic substrates with high temperature paste proved successful. Die attachment can be achieved using this technology as well. The underfill of the die becomes a critical factor in rework potentia
Electronics Forum | Sat Sep 20 11:24:27 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - volume of solder paste ? - Clean or not Clean so
Electronics Forum | Sat Jun 15 22:49:23 EDT 2002 | edahi
well as usual this for flip chip however, this application uses ceramic substrates and the nearby area in which the splatter land on is the marking area (gold pad). We cannot hide this because the package is completed bare die, meaning no heatspread
Electronics Forum | Sat Sep 20 11:44:39 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - PCB copper finisch ? (OSP,HASL, ENIG, etc) - v
Electronics Forum | Sat Jun 15 22:39:05 EDT 2002 | edahi
well we can't paste the flip chip on its substrate because we are using flux...because this bare die yet...and the surface of the die flipped might be contaminated...also after chip attach and reflow the die is to be underfilled and if the die is pas
Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest
Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te
Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F
Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process
Electronics Forum | Wed Jan 19 19:47:16 EST 2005 | davef
It depends. Let's focus. The basic versions of COB are: * Semiconductor die that you place on a glued board surface, wire bond, and then encapsulate. [The crazy uncle of the COB process, accounting for 90% of the placements.] * Semiconduct die tha
Electronics Forum | Mon Dec 28 12:16:40 EST 1998 | Jon Medernach
Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mechan
Electronics Forum | Tue Dec 29 10:24:35 EST 1998 | Earl Moon
| Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mech
