Electronics Forum: discover (Page 4 of 21)

From an environmental issue to an organizational issue

Electronics Forum | Thu May 19 17:24:18 EDT 2005 | Nickel

Europe (Eco-Lobbies) years ago wanted a sofisticated bike (WEEE & RoHS. etc) but now are discovering they (25 biker teams) are not able to bike !!! The good bikers are in China ( single team) and not suprised if they will be first also with this gam

BGA via in pad

Electronics Forum | Fri Mar 23 09:13:48 EDT 2007 | Peter W

Hello, those plated and solderable via in pads have two critical points: 1. We have discovered that _sometimes_ the plating seems not to be perfect, as extreme voiding is visible in tha bga solder ball 2. The detection of some defects by AXI is limi

Accidental Water wash & RMA mixing

Electronics Forum | Tue Dec 11 15:31:53 EST 2007 | chrisatae

We accidentally mixed water wash with RMA flux. When the heat was applied during through hole soldering we noticed a problem and we cleaned it as soon as we discovered it. But now there's a discoloration where it was applied. Anyone experience this a

AIS3500 on GSM1

Electronics Forum | Thu May 19 08:52:23 EDT 2011 | unidec

I just discovered this post, I believe we sent you a response to your inquiry. Please call 888-701-0038 or visit our unidec website knowledge base to get tips on loading the AIS3500EX. We repair the AIS3500EX vision systems at a reasonable cost.

Changing Ni/Au finish to HASL lead free

Electronics Forum | Tue Jan 04 10:40:41 EST 2011 | johanhuizing

Hello Piter, I don't know which type of HASL we will be using, we decided to do some test and I have to decide together with two other people which material we will try. Searching on the internet i discovered that it's not so easy to find a good sol

Excessive solder balls!

Electronics Forum | Fri Jul 08 13:09:25 EDT 2011 | joekirin

Thanks for all the input guys! After trying to figure this out in our smt process, we have discovered that the board house did not meet the required pad width for the fine pitched ICs when making the bare boards. Our stencil was cut out to fit the p

Solder pot inspection

Electronics Forum | Thu Jan 05 17:53:47 EST 2012 | warwolf

so our annual solder drain and inspection lead us to discover holes in the ceramic paint covering the inner layer of our solder pot, looks like some of the finer layers of the ceramic are left behind still protecting the steel, thinking about repairi

rigid-Flex board via problems

Electronics Forum | Thu Jan 19 12:38:03 EST 2012 | cobham1

I am wondering if the failurs that people see are discovered right away or when the units are out in the field. Reason I ask this follow up question is the units that are having problems are all returns from our customers. Is there a way to check for

bead blasting conformal coatings

Electronics Forum | Tue Feb 18 13:08:05 EST 2014 | hegemon

Paralene, Paraxylene, or other vacuum deposited coating will require this method to remove the coatings. UR and Acrylics have solvents, as Rob above has mentioned. Plastic bead media and wheat chaff are ones that I know have been used for Paralene

Solder buildup inside Relow Oven

Electronics Forum | Thu Oct 23 10:27:38 EDT 2014 | island2013

Is this happening on a new product you just introduced to the factory? If so, then I would check stencil design. Many moons ago we had a similar issue and discovered we were applying too much paste on the chip parts. We changed to a homeplate desig


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