Electronics Forum | Thu May 16 15:31:50 EDT 2002 | cebukid
Sounds like this 'Hussmann ' character is taking credit for my findings again. You'd "fit right in" where I work. Heh he hehe hehe.
Electronics Forum | Mon May 20 11:58:41 EDT 2002 | JoAnn
Greetings! The SMTA will be offering a course on this topic at SMTA International in Septmber. If you want a complete overview of this course please check out http://www.smta.org/smtai. Hope we might get to see you in September. JoAnn
Electronics Forum | Tue Feb 04 00:07:10 EST 2003 | MA/NY DDave
Hi David F Now I clicked on Phil's site and only got the front page. How do I or others get to the beef of this particular topic. Phil is funny and fast YiE, DDave
Electronics Forum | Tue Feb 04 08:20:18 EST 2003 | roertner
This rule is very conservative depending on the epoxy you use and the subsequent handling of the board prior to reflow. You should use lead to pad contact area. Also be sure to look at part height and clearance on your flowsolder machine.
Electronics Forum | Mon Aug 13 08:00:46 EDT 2007 | davef
Are the components that fall from the board solderable? Is the board solderable? Where is the solder for the components that fall from the board [eg, on the pads, on the component]?
Electronics Forum | Wed Jun 21 22:07:09 EDT 2000 | Jason
We are going to try double sided reflow for the first time. Can we use the same 63/37 paste on both sides? The board also has bare copper pads i'm pretty sure. will this present any challenges? The bottom side has a QFP on it. Should it stay on?
Electronics Forum | Fri Sep 07 09:19:44 EDT 2001 | Hussman
Jean, A lot depends on your process. can you add a dot of adhesive after screen printing and before placement? This works well for larger heavier parts. A second suggeestion is to reprofile your board. Try keeping the bottom side cooler. I do t
Electronics Forum | Thu May 09 16:04:07 EDT 2002 | stownsend
The lighter the component, the more likely it is to stick to the solder on the bottom reflow side. All boards I have worked with, the descrete components (R's and C's) are placed first (bottom side), reflowed, then the active components (IC's) are pl
Electronics Forum | Thu May 16 11:37:13 EDT 2002 | fmonette
My company offers a simple and cost effective control system for MSDs on the factory floor. It is a turnkey solution to comply with J-STD-033. If you want more information feel free to contact me offline. Francois Monette Cogiscan Inc. Tel : 450-53
Electronics Forum | Mon Feb 03 18:37:28 EST 2003 | jonfox
Not to be off-topic, but push engineering for embedded passives and remove parts from the underside all together. Watch the material cost sky rocket, but watch the manufacturing cost sink and well as improve the production cycle by 50%. Sorry, I w
